Factory Tour

World-Class Manufacturing Facility

Explore our state-of-the-art facility equipped with the latest technology for flex and rigid-flex PCB production.

Facility Overview

Our modern manufacturing facility combines advanced automation with skilled craftsmanship to deliver exceptional flex PCB products. We maintain strict environmental controls and follow lean manufacturing principles.

12
Production Lines
10,000
Clean Room Class

Advanced Equipment

We invest in the latest manufacturing technology to ensure precision and reliability

Laser Direct Imaging (LDI)

High-precision imaging systems for fine line patterns down to 25μm trace/space.

Laser Drilling

CO2 and UV laser systems for micro-via drilling as small as 50μm diameter.

Automated Optical Inspection

Advanced AOI systems for automated defect detection and quality verification.

Flying Probe Testing

High-speed electrical testing for prototype and low-volume production.

Plasma Cleaning

Surface treatment systems for optimal adhesion and reliability.

Lamination Press

Vacuum lamination systems for rigid-flex multilayer construction.

Highlights — Shenzhen SMT factory

Your flex and rigid-flex boards don't stop at fabrication. This is the in-house SMT / PCBA assembly line in Shenzhen that populates them — the equipment and controls that turn a bare circuit into a finished, tested board.

Nitrogen reflow oven on the Shenzhen SMT line
3D AOI inspection station
Per-board MES traceability scanning

26 placement machines across 11 SMT lines

YAMAHA YSM20R-2 high-speed and YSM10 high-precision platforms, with capacity for up to 20 million placements per day.

4 nitrogen reflow ovens (O₂ at 500–2,500 ppm)

Four of our six reflow ovens run a nitrogen atmosphere with oxygen controlled at 500–2,500 ppm, which reduces oxidation-related solder defects and widens the process window for process-critical assemblies.

01005 in stable mass production

01005 imperial / 0402 metric (roughly 0.4 × 0.2 mm) runs in stable mass production after DFM review, fed by 10 dedicated original YAMAHA ZSR micro-feeders for 4 mm tape.

PoP (package-on-package) assembly

Solder-paste dipping with warpage control and X-Ray verification of the stacked joints — running in stable production.

AI-assisted 3D SPI, AOI & X-Ray inspection

9× 3D SPI and 5× 3D AOI stations — the AI-assisted Sinic-Tek A510D AOI is linked live to MES — with X-Ray (UNICOMP AX8200) for hidden BGA and QFN joints, plus ICT/FCT. Coplanarity is measured on-line to ±0.03 mm per lead.

Deionized-water cleaning

Assemblies are cleaned with deionized water where the process calls for it, verified by 60–80× microscope inspection against the acceptance standard.

Production Process

Our streamlined manufacturing process ensures consistent quality and on-time delivery

1

Design Review & CAM

Expert engineers review your design files and optimize for manufacturability.

2

Material Preparation

High-quality polyimide and adhesive materials are prepared in our controlled environment.

3

Inner Layer Processing

Circuit patterns are created using LDI and precision etching processes.

4

Lamination

Multiple layers are bonded using vacuum lamination for optimal adhesion.

5

Drilling & Plating

Via holes are created and plated to establish electrical connections.

6

Surface Finish & Testing

Final finishes applied and 100% electrical testing performed.

Production Process Videos

Watch our advanced manufacturing processes in action

Laser Cutting Rigid-Flex PCB

Laser Cutting Rigid-Flex PCB

Precision laser cutting for rigid-flex PCB separation

Laser Cutting Rigid-Flex PCB Part 3

Laser Cutting Rigid-Flex PCB Part 3

Advanced laser depaneling technology demonstration

Flex Printed Board Depaneling

Flex Printed Board Depaneling

Flexible PCB depaneling process

Quality Control

Quality is built into every step of our manufacturing process. Our comprehensive QC system includes:

Incoming material inspection
In-process quality checks at each station
Automated optical inspection (AOI)
100% electrical testing
Final visual inspection
Cross-section analysis for critical orders
Reliability testing (thermal cycling, bend testing)

Ready to See Our Capabilities in Action?

Contact us to schedule a virtual factory tour or discuss your project requirements.

Contact Our Engineering Team