Explore our state-of-the-art facility equipped with the latest technology for flex and rigid-flex PCB production.
Our modern manufacturing facility combines advanced automation with skilled craftsmanship to deliver exceptional flex PCB products. We maintain strict environmental controls and follow lean manufacturing principles.
We invest in the latest manufacturing technology to ensure precision and reliability
High-precision imaging systems for fine line patterns down to 25μm trace/space.
CO2 and UV laser systems for micro-via drilling as small as 50μm diameter.
Advanced AOI systems for 100% automated defect detection and quality verification.
High-speed electrical testing for prototype and low-volume production.
Surface treatment systems for optimal adhesion and reliability.
Vacuum lamination systems for rigid-flex multilayer construction.
Your flex and rigid-flex boards don't stop at fabrication. This is the in-house SMT / PCBA assembly line in Shenzhen that populates them — the equipment and controls that turn a bare circuit into a finished, tested board.



Nitrogen reflow helps reduce oxidation-related solder defects and widens the process window for process-critical assemblies.
Dedicated 4 mm micro-feeders give stable 01005 placement on high-density SMT builds — not something every line is set up for.
01005 imperial / 0402 metric (roughly 0.4 × 0.2 mm), placed after DFM review for high-density boards.
Boards are serialized with unique barcodes that link their production and inspection data inside the MES.
3D SPI and AOI depending on the assembly, with X-Ray reserved for hidden BGA and QFN joints.
Assemblies are cleaned with deionized water where the process calls for it, followed by a 70× visual check for visible rosin residue.
Our streamlined manufacturing process ensures consistent quality and on-time delivery
Expert engineers review your design files and optimize for manufacturability.
High-quality polyimide and adhesive materials are prepared in our controlled environment.
Circuit patterns are created using LDI and precision etching processes.
Multiple layers are bonded using vacuum lamination for optimal adhesion.
Via holes are created and plated to establish electrical connections.
Final finishes applied and 100% electrical testing performed.
Watch our advanced manufacturing processes in action

Precision laser cutting for rigid-flex PCB separation

Advanced laser depaneling technology demonstration

Flexible PCB depaneling process
Quality is built into every step of our manufacturing process. Our comprehensive QC system includes:
Contact us to schedule a virtual factory tour or discuss your project requirements.
Contact Our Engineering Team