Explore our state-of-the-art facility equipped with the latest technology for flex and rigid-flex PCB production.
Our modern manufacturing facility combines advanced automation with skilled craftsmanship to deliver exceptional flex PCB products. We maintain strict environmental controls and follow lean manufacturing principles.
We invest in the latest manufacturing technology to ensure precision and reliability
High-precision imaging systems for fine line patterns down to 25μm trace/space.
CO2 and UV laser systems for micro-via drilling as small as 50μm diameter.
Advanced AOI systems for automated defect detection and quality verification.
High-speed electrical testing for prototype and low-volume production.
Surface treatment systems for optimal adhesion and reliability.
Vacuum lamination systems for rigid-flex multilayer construction.
Your flex and rigid-flex boards don't stop at fabrication. This is the in-house SMT / PCBA assembly line in Shenzhen that populates them — the equipment and controls that turn a bare circuit into a finished, tested board.



YAMAHA YSM20R-2 high-speed and YSM10 high-precision platforms, with capacity for up to 20 million placements per day.
Four of our six reflow ovens run a nitrogen atmosphere with oxygen controlled at 500–2,500 ppm, which reduces oxidation-related solder defects and widens the process window for process-critical assemblies.
01005 imperial / 0402 metric (roughly 0.4 × 0.2 mm) runs in stable mass production after DFM review, fed by 10 dedicated original YAMAHA ZSR micro-feeders for 4 mm tape.
Solder-paste dipping with warpage control and X-Ray verification of the stacked joints — running in stable production.
9× 3D SPI and 5× 3D AOI stations — the AI-assisted Sinic-Tek A510D AOI is linked live to MES — with X-Ray (UNICOMP AX8200) for hidden BGA and QFN joints, plus ICT/FCT. Coplanarity is measured on-line to ±0.03 mm per lead.
Assemblies are cleaned with deionized water where the process calls for it, verified by 60–80× microscope inspection against the acceptance standard.
Our streamlined manufacturing process ensures consistent quality and on-time delivery
Expert engineers review your design files and optimize for manufacturability.
High-quality polyimide and adhesive materials are prepared in our controlled environment.
Circuit patterns are created using LDI and precision etching processes.
Multiple layers are bonded using vacuum lamination for optimal adhesion.
Via holes are created and plated to establish electrical connections.
Final finishes applied and 100% electrical testing performed.
Watch our advanced manufacturing processes in action

Precision laser cutting for rigid-flex PCB separation

Advanced laser depaneling technology demonstration

Flexible PCB depaneling process
Quality is built into every step of our manufacturing process. Our comprehensive QC system includes:
Contact us to schedule a virtual factory tour or discuss your project requirements.
Contact Our Engineering Team