An 01005 chip (red box) placed and reflowed on a production board — photographed on our Shenzhen line, July 2026.
Placing an 01005 once is a demo. Running it every day is a capability. Our Shenzhen SMT floor places imperial 01005 components and builds PoP stacks in stable volume production — and this page shows the actual microscope, X-Ray, and feeder evidence instead of stock photos.
An 01005 chip (red box) placed and reflowed on a production board — photographed on our Shenzhen line, July 2026.
High-density assembly is not one machine setting — it is a chain: land-pattern and paste design that survives DFM review, feeders that can physically present 4 mm tape without misfeeds, placement platforms accurate enough for a 0.4 mm part, an inspection stack that can actually see the result, and traceability that catches drift before it becomes scrap.
Each item below is something running on the floor today, and the photos further down were taken from production boards in July 2026.
Imperial 01005 chips (~0.4 × 0.2 mm) are placed daily on YAMAHA YSM20R-2 and YSM10 machines — not a lab demo, but a running production process, supported after DFM review.
Dedicated original ZSR feeders for 4 mm tape keep 01005 feeding stable at production speed. Most standard SMT lines are not equipped for this tape format.
Solder-paste dipping process with upper/lower package alignment, warpage control, and X-Ray verification of the stacked joints — in stable volume production.
Sinic-Tek A510D 3D AOI with AI-assisted inspection feeds results into the MES in real time, so anomalies stop the line instead of shipping.
Four nitrogen ovens serve flex and rigid-flex assemblies for automotive, medical, industrial, and new-energy programs where wetting and process window matter.
On-line measurement — a figure from our own production floor, not a machine datasheet.
All four photos below were photographed on our Shenzhen line, July 2026.
| Smallest component | 01005 imperial (~0.4 × 0.2 mm), stable mass production after DFM review |
| Placement equipment | YAMAHA YSM20R-2 high-speed and YSM10 high-precision platforms, 26 placement machines across 11 SMT lines |
| 01005 feeding | 10 dedicated original YAMAHA ZSR feeders for 4 mm tape |
| PoP process | Solder-paste dipping, warpage control, X-Ray joint verification — stable production |
| Inspection | 9× 3D SPI and 5× 3D AOI (AI-assisted, MES-linked), plus X-Ray (UNICOMP AX8200) for hidden joints, and ICT/FCT |
| Soldering | 11 solder printers, 6 reflow ovens (4 nitrogen, O₂ controlled at 500–2,500 ppm), 2 wave-solder lines |
| Measured coplanarity | ±0.03 mm per lead, measured on-line |
| Cleaning | Deionized-water cleaning, verified by 60–80× microscope inspection against the acceptance standard |
| Factory | 9,600 m² across four floors in Shenzhen · team of 150 (16 engineering, 24 quality) · up to 20 million placements per day |
| Quality system | IATF 16949, ISO 9001, ISO 13485, ISO 14001 — certified to the Shenzhen manufacturing entity |
Engineering reviews 01005 land patterns, paste apertures, component spacing, stiffener zones, and PoP stack data before the build is accepted, so density problems are caught on paper instead of on the line.
01005 reels load onto dedicated 4 mm ZSR feeders and the placement program is verified against the BOM and XY data through MES anti-error checks.
High-density flex assemblies run through paste printing with 3D SPI, YAMAHA placement, nitrogen reflow where specified, and AI-assisted 3D AOI — each board tracked by its serialized barcode.
Hidden joints on BGA, QFN, and PoP stacks are verified by X-Ray sampling per the control plan, and inspection data is locked to the board record in MES before release.
Use this when the program needs general SMT and through-hole flex assembly control rather than extreme density.
Use this when rigid and flex sections combine in one assembly and the build needs 3D packaging control.
Use this when the bare circuit itself needs microvias, fine lines, and laser drilling before assembly.
Yes. Imperial 01005 (~0.4 × 0.2 mm) runs in stable mass production on YAMAHA YSM20R-2 and YSM10 machines, fed by 10 dedicated original ZSR feeders for 4 mm tape. The microscope and on-board photos on this page were taken on our own Shenzhen line in July 2026, from production boards.
They are the same physical size described in two unit systems: 01005 imperial is approximately 0.4 × 0.2 mm, which the metric system calls 0402. Confusion arises because 0402 imperial is a different, larger part (~1.0 × 0.5 mm). We confirm the intended size during DFM review before any high-density build.
Yes, with the right preparation. Flex and rigid-flex assemblies are panelized and supported with carriers or stiffeners so the placement area is flat and stable, and the DFM review checks land patterns and support zones before the build. The placement and inspection chain is the same one used for our densest rigid boards.
Our PoP process uses solder-paste dipping with upper and lower package alignment and warpage control, and the stacked joints are verified by X-Ray, since the lower package joints are hidden from optical inspection. The process runs in stable production, not as a sample-only capability.
The Sinic-Tek A510D applies AI-assisted defect recognition on top of 3D measurement, and its results feed the MES in real time. When an anomaly is detected, the affected boards are locked in the system so they cannot travel forward — inspection acts as a gate, not just a report.
Send Gerber or ODB++, BOM, XY (pick-and-place) data, the stackup, and the assembly drawing. For PoP content, include the stack data for the upper and lower packages. Engineering runs a DFM review on the high-density content first, and the quote follows the reviewed scope.
Send the Gerber or ODB++, BOM, and XY data. Engineering reviews the high-density content first and comes back with DFM feedback and a quote based on the reviewed scope.
Start With a DFM Review