A rigid-flex PCB bonds polyimide flex layers to FR4 rigid sections in one part, replacing the rigid-board-plus-cable-plus-connector chain with a single continuous interconnect.
FlexiPCB builds 2-30 layer rigid-flex with 3.5mil trace, laser microvias, and ±3Ω impedance to IPC-6013 / IPC-A-610 Class 3.
The buyer decision is reliability and connector elimination, not bare-board price: every removed board-to-board connector is a removed vibration and solder-joint failure point.
Send the flex-to-rigid transition zones, bend radius, and Class 2 vs Class 3 acceptance up front so the stackup is symmetrical and the bend zone stays free of vias.
Rigid-flex PCBs seamlessly integrate rigid and flexible circuit technologies into a single interconnected assembly. By bonding flexible polyimide layers with fixed FR4 stiffeners, these hybrid circuits eliminate the need for connectors and ribbon cables, significantly improving signal integrity while enabling complex 3D packaging solutions. The result is a lighter, more reliable design that withstands vibration, shock, and harsh environmental conditions.
Mission-critical avionics systems, flight controls, satellite communications, and radar equipment. Our 10+ layer rigid-flex designs meet stringent requirements for high signal integrity, lightweight construction, and mechanical resilience with precise impedance control.
Advanced imaging equipment, surgical robots, patient monitoring systems, and implantable devices. Rigid-flex technology enables miniaturization while maintaining the reliability essential for life-critical medical applications.
ADAS sensors, infotainment systems, dashboard displays, and camera assemblies. Rigid-flex PCBs withstand automotive vibration, temperature extremes, and provide reliable interconnections in space-constrained enclosures.
Automation controllers, robotic arms, test equipment, and sensor modules. The mechanical durability of rigid-flex circuits handles continuous movement and harsh industrial environments with exceptional reliability.
Our engineers collaborate on optimal layer stackup configuration—whether bookbinder, asymmetrical, flex-in-core, or flex-on-external—tailored to your specific requirements.
Application-specific material selection based on thermal, mechanical, and electrical requirements. Polyimide flex layers paired with appropriate FR4 or specialty rigid materials.
Precision laser drilling creates ultra-small microvias down to 3 mil diameter, enabling high-density interconnects while maintaining signal integrity.
After mechanical drilling, holes are chemically cleaned and copper-deposited through electroless and electrolytic plating processes for reliable via connections.
Multiple precisely controlled lamination cycles bond rigid and flex layers using coverlay polyimide film with acrylic or epoxy adhesives.
Comprehensive electrical testing verifies isolation, continuity, and circuit performance. Every board is inspected to IPC-A-610H Class 3 standards.
Complete fabrication and assembly under one roof eliminates third-party dependencies and ensures quality control at every step.
Up to 30-layer rigid-flex with 3/3 mil features, heavy copper options, and configurable stack-up configurations for complex designs.
All builds manufactured to IPC-A-610H Class 3 standards, ensuring circuit reliability for aerospace, medical, and automotive applications.
Dedicated rigid-flex engineers provide comprehensive DFM review, design verification, and optimization recommendations with every project.
Transition-zone and bend data let engineering quote reliability risk instead of guessing.
Gerber, drill, stackup with rigid and flex sections identified, and coverlay-to-rigid transition detail
Bend radius, static versus dynamic flex, fold count, bookbinder requirement, and the installed 3D envelope
Layer count, flex-in-core versus flex-on-external preference, and which layers carry controlled impedance
IPC-6013 Class 2 versus Class 3, IPC-2223 type, surface finish, stiffener locations, and MOQ/forecast
Required reports: COC, electrical test, impedance coupon, cross-section, and lot traceability
The response is written for procurement, quality, and engineering review.
DFM comments on transition-zone keepout, stackup symmetry, bend radius, copper balance, and via placement
Recommended structure (flex-in-core or flex-on-external) with layer stackup and impedance modeling notes
Quotation with MOQ, sample lead time, production lead time, tooling, and sequential-lamination cost drivers
Inspection plan covering electrical test, impedance coupon, cross-section, and IPC-A-610 Class 2/3 acceptance
Production release checklist for drawing revision, lot traceability, packaging, and repeat-order control
Rigid-flex carries a higher bare-board cost than a rigid PCB plus ribbon cable, so it pays off when reliability, weight, or volume forces the decision. The classic case is a vibration- or shock-loaded assembly where every board-to-board connector is a failure point: removing two connectors and a ribbon cable often removes the dominant field-failure mode. It also wins when a rigid-cable-rigid chain must fold into a 3D enclosure that no straight cable can reach. If the assembly is static, low-vibration, and roomy, a rigid board with an FFC is usually cheaper and we will say so at DFM.
The transition between the rigid section and the flex tail is the highest-stress region and the most common crack location. We keep all plated vias, stiffeners, and component pads out of the bend zone, taper copper at the transition, and define the coverlay-to-rigid butt or overlap per your IPC-2223 type. A symmetrical, balanced stackup prevents the asymmetric stress that warps the rigid section and fractures conductors at the boundary after thermal cycling. Tell us static versus dynamic bend and bend radius so we set the neutral-axis layer placement correctly.
Flex-in-core places the flex layers at the center of the rigid stackup, which protects them and suits high-layer-count builds but constrains where you can route the flex tail. Flex-on-external puts the flex on outer layers for easier multi-direction folding at lower layer counts. We do not pick from a table: bend direction, number of fold points, layer count, and impedance needs drive the choice. Send your fold geometry and we model the symmetrical stackup, then confirm bookbinder allowance if the flex must fold over itself.
Public references provide context; your drawings and purchase specifications control production acceptance.
IPC-6013 and IPC-2223 are the performance and design references for rigid-flex boards, including type classification and bend-zone rules.
Polyimide is the flexible dielectric bonded to the FR4 rigid sections; its thermal and mechanical stability sets bend and reliability limits.
FR-4 forms the rigid sections of a rigid-flex board; its glass-epoxy construction provides the component-mounting and connector stability.
Written for OEM procurement teams evaluating rigid-flex PCB suppliers at RFQ stage.
FlexiPCB manufacturing and sourcing specialist
Hommer Zhao has supported flexible, rigid-flex, and cable-integrated builds for OEM procurement teams since 2008. For rigid-flex programs, the engineering review focuses on the flex-to-rigid transition zone, stackup symmetry, sequential lamination, Class 3 acceptance, and repeat-order traceability for aerospace, medical, and automotive customers.
Capability
2-30 layer rigid-flex, 3.5mil trace, laser microvias, up to 12:1 through-hole aspect ratio
Reliability
IPC-6013 / IPC-A-610 Class 3, symmetrical stackups, twist and warp held to 0.75%
Case evidence
Multilayer rigid-flex replaced a rigid-cable-rigid chain in an avionics module, removing connector failure points and cutting interconnect weight
Standards
IPC-6013, IPC-2223, IPC-A-610 Class 3, ISO 9001
See our rigid-flex PCB products and manufacturing capabilities
Precision laser cutting for rigid-flex PCB separation
High layer count rigid-flex for industrial control systems
Ultra-complex 20-layer rigid-flex PCB demonstration
Discover our complete range of flex PCB manufacturing and assembly services
A long-standing wire harness customer was independently sourcing PCB assemblies and electronic components for their industrial machinery.
The customer had separate suppliers for harnesses and PCBAs, leading to fragmented supply chains, potential assembly misalignments, and complex logistics for their integration team.
Identified the PCBA opportunity during routine harness order follow-ups and introduced the customer to a dedicated PCB assembly engineering team. Facilitated technical consultations between the customer's electronic engineers and the PCBA team to quote specific ICs (e.g., STM32F105RBT6) and board manufacturing.
Successfully onboarded the customer for PCB/PCBA and component sourcing, consolidating their supply chain and increasing the annual program value from five-figure harness orders to a broader multi-category manufacturing partnership.
Customer details are anonymized. Numbers and scope are reported as delivered.
