Custom Flex PCB

Custom Flex PCB

Polyimide Flexible Circuits Built to Your Drawing

ISO 9001|ISO 13485|IATF 16949
Engineering review before quotationPrototype through volume productionTest report and traceability support
Custom Flex PCB

TL;DR

A flex PCB (flexible printed circuit) is a polyimide-based circuit that bends to fit moving or space-constrained assemblies, replacing rigid boards and board-to-board connectors.

FlexiPCB builds 1-6 layer flex (up to 10 ultimate), 0.05-0.8mm thick, single-ended impedance to ±5Ω, with samples in 3-6 business days.

Total cost is driven less by bare-board price than by connector elimination, panel utilization, and stackup simplification.

ISO 9001, ISO 13485, IATF 16949, and UL are mapped to inspection and traceability for medical, automotive, and aerospace programs.

Custom Flexible Circuit Manufacturing

Custom flex PCB programs need more than a generic FPC price. FlexiPCB engineers the polyimide laminate, copper weight, coverlay opening, stiffener support, surface finish and bend-zone rules around your enclosure and reliability target. IPC-6013 Class 2/3, IPC-A-600 inspection context, IPC-A-610 assembly support and UL material traceability are available for regulated OEM programs.

1-6 layers standard, up to 10 layers ultimate
Min 3mil trace/space, 0.1mm laser drill
Single-ended impedance ±5Ω (advanced: ±3Ω)
Board thickness 0.05-0.5mm (ultimate: 0.8mm)
Lead time 3-6 days, expedited 2-4 days
100% AOI and flying probe tested
Typical prototype budget: USD 180-350 simple flex, USD 600+ for multilayer controlled-impedance builds
Best ROI when flex eliminates connectors, reduces assembly labor, or fits a moving mechanical envelope

Technical Specifications

Layer Count1-6 layers (Ultimate: 7-10 layers)
Base Material (Adhesive)Shengyi SF302 (PI: 0.5/1/2mil, Cu: 0.5/1oz), SF305 (PI: 0.5/1/2mil, Cu: 0.33/0.5/1oz)
Base Material (Adhesiveless)Songxia RF-775/777 (PI: 1/2/3mil, Cu: 0.5/1oz, Ultimate: 2oz), Xinyang (PI: 1/2mil, Cu: 0.33/0.5/1oz), Taihong (PI: 1/2mil, Cu: 0.33/0.5/1oz), Dupont AP (PI: 1/2/3/4mil, Cu: 0.5/1oz, Ultimate: 2oz)
Board Thickness (Flex Part)0.05-0.5mm (Ultimate: 0.5-0.8mm)
Min. Size5mm×10mm (Bridgeless), 10mm×10mm (Bridge); Ultimate: 4mm×8mm / 8mm×8mm
Max. Size9"×14" (Ultimate: 9"×23" with PI≥1mil)
Impedance (Single-ended)±5Ω (≤50Ω), ±10% (>50Ω); Ultimate: ±3Ω (≤50Ω), ±8% (>50Ω)
Impedance (Differential)±5Ω (≤50Ω), ±10% (>50Ω); Ultimate: ±4Ω (≤50Ω), ±8% (>50Ω)
Budgetary Prototype RangeUSD 180-350 simple flex; USD 600-1,500 multilayer or controlled-impedance flex
Best Production Cost LeverReduce connector count, standardize stiffeners, and lock panel utilization early
Finger Width Tolerance±0.1mm (Ultimate: ±0.05mm)
Min. Distance to Finger Edge8mil (Ultimate: 6mil)
Min. Distance Between Pads4mil (Ultimate: 3mil)
Min. Laser Hole0.1mm
Min. PTH0.3mm
Min. NPTH Tolerance±2mil (Ultimate: +0/-2mil or +2/-0mil)
Solder Bridge (Cu<2oz)4mil (Green), 8mil (Other colors)
Solder Bridge (Cu 2-4oz)6mil (Green), 8mil (Other colors)
Coverlay ColorWhite, Yellow (printed character: White)
Surface FinishOSP, HASL, Lead-Free HASL, ENIG, Hard Gold, Immersion Silver
Selective Surface FinishENIG+OSP, ENIG+Gold Finger

Applications

Consumer Electronics

Smartphones, wearables, cameras, and portable devices requiring compact, flexible interconnects with space-saving layouts. Buyers here usually justify flex by cutting assembly steps and reclaiming enclosure volume.

Medical Devices

Implantable devices, catheters, hearing aids, and diagnostic equipment demanding biocompatibility and high reliability. Validation risk, stackup stability, and documentation often matter as much as lead time.

Automotive

Dashboard displays, sensors, LED lighting, and engine control units requiring vibration resistance and durable bend performance. Cost is usually recovered by simplifying routed packaging and replacing multiple connectors.

Aerospace & Defense

Satellites, avionics, and military systems where weight reduction and connection reliability are critical. The real objection is usually documentation and repeatability, not just bare-board price.

Our Manufacturing Process

1

Design Review

Our engineers analyze your Gerber files for manufacturability and suggest optimizations for flex circuit design, especially bend-zone copper balancing, stiffener placement, and panel yield.

2

Material Selection

We select optimal polyimide materials (Shengyi, Dupont, Songxia) based on your bend radius and thermal requirements.

3

Circuit Fabrication

Precision LDI imaging with 3mil trace/space capability and laser drilling for HDI flex circuits.

4

Coverlay Application

Protective coverlay lamination with precise alignment for circuit protection and insulation.

5

Testing & Inspection

100% electrical testing with flying probe and AOI inspection ensures quality and reliability.

Why Choose FlexiPCB?

Fast Lead Time

Standard delivery in 3-6 days. Expedited options available in 2-4 days for urgent projects, which matters most when prototype validation is blocking enclosure or assembly testing.

Design Support

Free DFM review and expert guidance on flex circuit design, material selection, and bend radius optimization. We push back when rigid PCB or FFC is commercially smarter instead of forcing flex into the design.

Quality Certified

ISO 9001, ISO 13485, IATF 16949, and UL certified. 100% AOI inspection and flying probe testing. Buyers worried about hidden risk usually need process control more than the absolute lowest unit quote.

Factory Direct Pricing

Competitive pricing from our 15,000m² manufacturing facility with transparent quotes and no hidden fees. In most programs, the strongest savings come from panel utilization, connector elimination, and stackup simplification rather than squeezing laminate cost alone.

Send This With Your Custom Flex PCB RFQ

Drawing-specific details let engineering quote a manufacturable custom flex circuit.

Gerber or ODB++, fabrication drawing, stackup, finished flex thickness, and layer count

Bend radius, static versus dynamic flex, cycle expectation, and installed mechanical envelope

Polyimide laminate preference, coverlay openings, stiffener locations, ENIG/OSP/hard-gold finish, and impedance targets

IPC-6013 Class 2/3, IPC-A-600/610 acceptance needs, UL/RoHS/REACH documentation, and lot traceability

Prototype quantity, production forecast, target ship date, and any assembly or connector requirements

What You Get Back

The response is written for procurement, quality, and engineering review.

DFM comments on bend-zone copper balance, stiffener placement, coverlay clearance, layer stackup, and panel yield

Quotation with MOQ, sample lead time, production lead time, tooling, impedance and finish cost drivers, and material risk

Inspection plan covering AOI, flying-probe electrical test, impedance coupon, and report format

Standards map for ISO 9001, ISO 13485, IATF 16949, and UL documentation needs

Production release checklist for drawing revision, lot traceability, packaging, and repeat-order control

What is a flex PCB and when should I use one?

A flex PCB is a flexible printed circuit built on polyimide film instead of rigid FR-4, so it can bend, fold, or fit a 3D mechanical envelope. It is the right choice when you need to fit a curved or moving space, remove board-to-board connectors, cut weight, or survive repeated bending. If the board never moves and space is not constrained, a rigid PCB or a flat flexible cable (FFC) is often cheaper, and we will say so during DFM rather than force flex into the design.

How many layers and what thickness can you build?

Standard builds run 1-6 layers with ultimate capability to 10 layers for specialized multilayer flex. Flex-section thickness is 0.05-0.5mm typical (0.8mm ultimate), with single-ended impedance held to ±5Ω (±3Ω advanced). Layer count, stackup, and stiffener placement are chosen from your bend radius, impedance targets, and reliability requirements, not from a generic table, because a stackup that ignores bend-zone copper balance can crack after assembly.

What should I send for an accurate flex PCB quote?

Send Gerber and drill files, stackup, finished flex thickness target, bend radius with static-versus-dynamic flex and bend-cycle expectation, coverlay and stiffener needs, surface finish, impedance targets, quantity and annual forecast, sample date, and required reports. A complete package lets engineering return pricing, DFM notes, sample lead time, and reliability risks without avoidable assumptions.

Standards and Public References

Public references provide context; your drawings and purchase specifications control production acceptance.

Factory Engineering Note

Written for OEM procurement teams evaluating flex PCB suppliers at RFQ stage.

Hommer Zhao

FlexiPCB manufacturing and sourcing specialist

Hommer Zhao has supported flexible PCB, PCBA, and cable-integrated builds for OEM procurement teams since 2008. For flex PCB programs, the engineering review focuses on bend-zone design, stackup and stiffener choices, impedance control, sample timing, inspection evidence, and repeat-order traceability.

Factory KPI

3-6 business day typical samples after complete RFQ and material approval

Production KPI

Expedited samples in 2-4 business days for validation-blocking programs

Case evidence

Medical wearable build consolidated 3 rigid interconnect boards into one 2-layer flex, cutting final assembly time 27% and removing 2 connector failure points

Standards

ISO 9001, ISO 13485, IATF 16949, UL

Flex PCB Manufacturing Process

Watch our precision flex PCB depaneling process in action

Flex Printed Board Depaneling

High-precision flexible PCB depaneling and separation process

Explore Our Other Services

Discover our complete range of flex PCB manufacturing and assembly services