沒有支撐的柔性電路不能用一般FR-4硬板的思路處理。層壓材料可能下垂，焊料可能流入敏感區域，熱量也可能傷害膠層與剛撓過渡區。因此我們只承接具備真實支撐、正確遮蔽與可控浸焊條件的案件。
當柔性板在補強區安裝排針、插針或屏蔽罩時，我們會先定義托盤、潤濕與排錫路徑，再決定是否放行量產。
靜態區域內的端子、排針與through-hole硬體需要的是可重複製程，而不是產線尾端補焊。
對於要求追溯與FAI的專案，我們只在設計確實允許的區域採用波峰焊，否則優先改為選擇性焊接。
We review support conditions, solder-side exposure, component mass, and whether wave soldering is truly justified before approving the route.
For approved jobs, we define pallet support, masking, and immersion depth so static zones are soldered while sensitive flex areas stay protected.
SMT, reflow, and any required bake are completed first. Through-hole parts are then loaded and checked for seating, lead trim, and solder-fill expectations.
Flux, preheat, conveyor settings, and solder contact time are tuned to the actual assembly rather than copied from a rigid-board recipe.
We check fill, bridges, solder balls, and heat impact near flex transitions before documenting the release decision and next-step feedback.
If full-wave is not the right answer, we say that before tooling and schedule are locked.
Support strategy, masking, and immersion assumptions are part of the quotation review, not a surprise found on the line.
You get a process recommendation, lead-time logic, and the specific risks that still need resolution.
技術資料越完整，我們越能快速判斷該走波峰焊還是選擇性焊接。
Gerber or assembly drawing with through-hole parts marked clearly
BOM, connector part numbers, and approved alternates if any
Stiffener, support, or stackup details around connector zones
Prototype, pilot, and production quantities plus FAI or test-report needs
不只是價格，還包括製程建議、治具假設與實際風險說明。
Process recommendation: palletized wave, selective solder, or controlled manual soldering
Quoted lead time and tooling assumptions
DFM feedback on support, masking, and solder-side exposure
Inspection and first-article documentation plan
不適合。大多數無支撐柔性板都不是理想對象。我們會先確認局部剛性、焊接面暴露與載具策略。
當through-hole焊點不多、SMT密度高，或整板過波會增加不必要風險時，選擇性焊接通常更穩妥。
請提供Gerber或裝配圖、BOM、連接器料號、stiffener資訊、數量以及FAI或測試報告需求。
以下資料說明了我們在評估每個專案時參考的標準與焊接方法背景。
Overview of the wave soldering process, equipment behavior, and common defect mechanisms.
Background on IPC workmanship and printed board standards commonly referenced for assembly programs.
Reference background for safety and certification frameworks often requested in regulated electronics programs.
關鍵不是把板子送過錫波，而是從一開始就把支撐方式、遮蔽方案與放行標準定義清楚。
