A flex PCB (flexible printed circuit) is a polyimide-based circuit that bends to fit moving or space-constrained assemblies, replacing rigid boards and board-to-board connectors.
FlexiPCB builds 1-6 layer flex (up to 10 ultimate), 0.05-0.8mm thick, single-ended impedance to ±5Ω, with samples in 3-6 business days.
Total cost is driven less by bare-board price than by connector elimination, panel utilization, and stackup simplification.
ISO 9001, ISO 13485, IATF 16949, and UL are mapped to inspection and traceability for medical, automotive, and aerospace programs.
FlexiPCB manufactures flex PCBs with layer counts from 1 to 6, with ultimate builds extending to 10 layers for specialized multi-layer flex circuits. Fabrication uses polyimide base materials such as Shengyi SF305, Songxia RF-775, and Taihong PI, supporting dielectric stability, thermal resistance, and fine-line processing. For most buyer programs, the real decision is whether flex PCB reduces total installed cost by removing connectors, shrinking the enclosure, or simplifying assembly. A recent medical wearable build consolidated three rigid interconnect boards into one 2-layer flex design, cutting final assembly time by 27% and removing two board-to-board connector failure points. Budget-wise, a simple prototype often lands around USD 180-350, while multilayer controlled-impedance flex with stiffeners and selective finish can move into the USD 600-1,500 range before assembly.
Smartphones, wearables, cameras, and portable devices requiring compact, flexible interconnects with space-saving layouts. Buyers here usually justify flex by cutting assembly steps and reclaiming enclosure volume.
Implantable devices, catheters, hearing aids, and diagnostic equipment demanding biocompatibility and high reliability. Validation risk, stackup stability, and documentation often matter as much as lead time.
Dashboard displays, sensors, LED lighting, and engine control units requiring vibration resistance and durable bend performance. Cost is usually recovered by simplifying routed packaging and replacing multiple connectors.
Satellites, avionics, and military systems where weight reduction and connection reliability are critical. The real objection is usually documentation and repeatability, not just bare-board price.
Our engineers analyze your Gerber files for manufacturability and suggest optimizations for flex circuit design, especially bend-zone copper balancing, stiffener placement, and panel yield.
We select optimal polyimide materials (Shengyi, Dupont, Songxia) based on your bend radius and thermal requirements.
Precision LDI imaging with 3mil trace/space capability and laser drilling for HDI flex circuits.
Protective coverlay lamination with precise alignment for circuit protection and insulation.
100% electrical testing with flying probe and AOI inspection ensures quality and reliability.
Standard delivery in 3-6 days. Expedited options available in 2-4 days for urgent projects, which matters most when prototype validation is blocking enclosure or assembly testing.
Free DFM review and expert guidance on flex circuit design, material selection, and bend radius optimization. We push back when rigid PCB or FFC is commercially smarter instead of forcing flex into the design.
ISO 9001, ISO 13485, IATF 16949, and UL certified. 100% AOI inspection and flying probe testing. Buyers worried about hidden risk usually need process control more than the absolute lowest unit quote.
Competitive pricing from our 15,000m² manufacturing facility with transparent quotes and no hidden fees. In most programs, the strongest savings come from panel utilization, connector elimination, and stackup simplification rather than squeezing laminate cost alone.
Complete drawings let engineering quote bend and impedance risk instead of guessing.
Gerber, drill, stackup, coverlay, stiffener drawing, and finished flex thickness target
Bend radius, static versus dynamic flex, bend-cycle expectation, and the installed mechanical envelope
Impedance targets (single-ended and differential), controlled-impedance layers, and reference-plane needs
Surface finish, selective finish, MOQ, sample quantity, annual forecast, and target approval date
Required reports: COC, electrical test, impedance coupon, cross-section, inspection photos, and lot traceability
The response is written for procurement, quality, and engineering review.
DFM comments on bend-zone copper balance, stiffener placement, coverlay clearance, layer stackup, and panel yield
Quotation with MOQ, sample lead time, production lead time, tooling, impedance and finish cost drivers, and material risk
Inspection plan covering AOI, flying-probe electrical test, impedance coupon, and report format
Standards map for ISO 9001, ISO 13485, IATF 16949, and UL documentation needs
Production release checklist for drawing revision, lot traceability, packaging, and repeat-order control
A flex PCB is a flexible printed circuit built on polyimide film instead of rigid FR-4, so it can bend, fold, or fit a 3D mechanical envelope. It is the right choice when you need to fit a curved or moving space, remove board-to-board connectors, cut weight, or survive repeated bending. If the board never moves and space is not constrained, a rigid PCB or a flat flexible cable (FFC) is often cheaper, and we will say so during DFM rather than force flex into the design.
Standard builds run 1-6 layers with ultimate capability to 10 layers for specialized multilayer flex. Flex-section thickness is 0.05-0.5mm typical (0.8mm ultimate), with single-ended impedance held to ±5Ω (±3Ω advanced). Layer count, stackup, and stiffener placement are chosen from your bend radius, impedance targets, and reliability requirements, not from a generic table, because a stackup that ignores bend-zone copper balance can crack after assembly.
Send Gerber and drill files, stackup, finished flex thickness target, bend radius with static-versus-dynamic flex and bend-cycle expectation, coverlay and stiffener needs, surface finish, impedance targets, quantity and annual forecast, sample date, and required reports. A complete package lets engineering return pricing, DFM notes, sample lead time, and reliability risks without avoidable assumptions.
Public references provide context; your drawings and purchase specifications control production acceptance.
IPC-6013 and IPC-A-600 are used as performance and workmanship references for flexible and rigid-flex printed boards.
Polyimide film is the base dielectric for most flex PCBs; its thermal and mechanical stability sets bend and reliability limits.
UL recognition matters when the flex PCB ships inside a regulated medical, automotive, or consumer assembly.
Written for OEM procurement teams evaluating flex PCB suppliers at RFQ stage.
FlexiPCB manufacturing and sourcing specialist
Hommer Zhao has supported flexible PCB, PCBA, and cable-integrated builds for OEM procurement teams since 2008. For flex PCB programs, the engineering review focuses on bend-zone design, stackup and stiffener choices, impedance control, sample timing, inspection evidence, and repeat-order traceability.
Factory KPI
3-6 business day typical samples after complete RFQ and material approval
Production KPI
Expedited samples in 2-4 business days for validation-blocking programs
Case evidence
Medical wearable build consolidated 3 rigid interconnect boards into one 2-layer flex, cutting final assembly time 27% and removing 2 connector failure points
Standards
ISO 9001, ISO 13485, IATF 16949, UL
Watch our precision flex PCB depaneling process in action
High-precision flexible PCB depaneling and separation process
Discover our complete range of flex PCB manufacturing and assembly services
A South Asian EV motorcycle OEM initially approached for wire harness manufacturing also had underlying needs for electronic assemblies to complete their vehicle architecture.
The customer's focus was on the wire harness, but they also required PCBs and PCBA for critical vehicle components. They were evaluating separate supply chains, which could lead to integration issues and higher logistics costs.
Proactively recommended PCB and PCBA services during the wire harness quotation phase. Coordinated internal PCB specialists to provide integrated quotes for the Key Fob, VCU Board, and COM Board, emphasizing a one-stop-shop solution.
The customer actively engaged with the PCB/PCBA quotes, repeatedly following up on the COM Board pricing, demonstrating successful cross-selling and moving towards a consolidated supply chain for both wire harnesses and circuit boards.
Customer details are anonymized. Numbers and scope are reported as delivered.