高速訊號無法容忍阻抗不連續。當軟性電路傳輸LVDS、USB 3.x、PCIe、MIPI、車用乙太網路或100MHz以上RF訊號時，阻抗控制是基本設計要求。FlexiPCB使用校準聚醯亞胺基材製造1至10層阻抗控制軟性電路。
USB 3.x、PCIe Gen4/5、HDMI 2.1用阻抗控制差動對。
100BASE-T1/1000BASE-T1，100歐姆差動。
天線饋電、RF前端用50歐姆控制阻抗。
超音波換能器陣列、CT掃描儀多通道阻抗控制。
MIPI CSI-2/DSI，100歐姆差動。
寬頻50歐姆，DC至40GHz。
2D電磁場求解器建模最佳疊層。
選擇特性化聚醯亞胺層壓板。
LDI ±10µm精度，線寬控制±10%。
真空層壓，介電層厚度±10%。
每板含測試試片。
電測、IPC-A-610目視檢查。含TDR波形阻抗報告。
2D場求解器建模。
每塊板TDR試片驗證。
製程控制確保標準±5%。
全頻譜製造經驗。
The more complete the package, the faster and cleaner the quote.
Gerber, drawing, or sample photos
BOM, stackup, and key materials
Quantity, target lead time, and application
Designed to help procurement and engineering move without extra loops.
DFM and manufacturability feedback
Quoted price, tooling, and lead time options
Testing and documentation plan
Send your drawing or Gerber, BOM, quantity forecast, application environment, and target lead time. Incomplete inputs slow quotation and increase assumptions.
Our engineers review risks first, then return pricing, lead time, and any DFM or sourcing concerns so you can compare options before release.
Yes. The same workflow supports prototype validation, pilot build, and volume release with traceability and testing requirements carried forward.
