Six-layer flex PCBs push the boundaries of flexible circuit technology, offering the routing density and electrical performance needed for advanced applications in aerospace, medical, and high-performance computing.
With six conductive layers, designers gain maximum flexibility in layer assignment. Multiple signal layers can be sandwiched between ground planes for optimal shielding. Power distribution can be separated from sensitive signal routing. Complex via structures including stacked and staggered microvias enable component placement with the highest pin densities.
Our 6-layer flex service leverages advanced manufacturing processes including sequential lamination, laser drilling, and precision impedance control. We support both all-flex and rigid-flex configurations with the quality certifications needed for aerospace and medical applications.
Six layers provide extensive routing channels. Multiple signal layers with dedicated reference planes enable the highest interconnect density.
Stacked and staggered microvias, via-in-pad, and any-layer interconnects. Full ELIC (Every Layer Interconnect) when required.
Signal layers can be fully enclosed between ground planes for maximum EMI protection. Critical for sensitive analog and high-frequency applications.
Multiple power domains with dedicated plane layers. Low impedance power distribution for high-current and mixed-signal designs.
6-layer flex PCBs serve the most demanding applications in advanced electronics.
Flight control systems, satellite payloads, and avionics use 6-layer flex for complex signal routing in weight-constrained applications.
CT scanners, MRI systems, and ultrasound equipment use 6-layer flex for high-density data acquisition with excellent signal integrity.
Server interconnects and data center equipment benefit from 6-layer flex's ability to route high-speed differential pairs with controlled impedance.
Radar, electronic warfare, and communication systems use 6-layer flex for reliable performance in harsh environments with complex functionality.
Flagship smartphones and tablets use 6-layer flex for the highest component density and most compact designs.
6-layer flex stackup design balances electrical requirements with manufacturing constraints.
Signal-Ground-Signal-Signal-Ground-Signal configurations provide balanced construction for reliable manufacturing. Ideal for most applications.
When specific electrical requirements demand it, asymmetric stackups can be designed with careful attention to manufacturing implications.
Thin cores enable tight total thickness while prepreg layers provide lamination bonds. Material selection impacts both electrical and mechanical properties.
Multiple impedance values can be achieved on different layers. We optimize dielectric thicknesses to meet your various impedance requirements.
For rigid-flex applications, the flex region may use fewer layers than rigid areas to maintain flexibility. Layer transitions require careful design attention.
6-layer flex fully exploits HDI via technology for maximum density.
Multiple via layers stacked directly over each other enable vertical interconnects through multiple layers. Requires sequential lamination for reliability.
Offset via placement on successive layers. More manufacturable than stacked vias while still enabling high density.
Component pads placed directly over vias with conductive fill. Maximizes component density for fine-pitch packages.
Blind vias spanning multiple layers. Connect outer layer directly to inner layers without intermediate connection.
Advanced interconnect technology enabling via connection between any two adjacent layers throughout the stackup. Maximum routing flexibility.
Space-grade 6-layer flex for satellite communication payload. NASA low-outgassing certified with controlled impedance for Ku-band RF routing.
High-density 6-layer flex connecting 256-channel ultrasound transducer array. Fine-pitch routing with excellent crosstalk isolation.
6-layer flex antenna feed network for 64-element 5G massive MIMO array. Controlled impedance with integrated power distribution.
Minimum total thickness depends on copper weights and dielectric requirements. Typical minimum is around 0.3mm for standard copper weights. We can work with you to minimize thickness for your application.
Yes, though with larger bend radius requirements than fewer-layer designs. Typical minimum bend radius is 10x thickness. For rigid-flex, we optimize flex region layer count.
Prototype lead time is typically 10-15 business days depending on via structure complexity. Sequential lamination for HDI vias adds processing time.
Yes, we support stacked microvia structures with appropriate fill and planarization. Our processes are validated for reliable stacked via interconnects.
Our 6-layer flex manufacturing is supported by ISO 9001, and we offer AS9100D certification for aerospace applications and ISO 13485 for medical devices.
