Flexible PCB assembly combines flex circuit fabrication, SMT placement, connector attach, inspection, and functional test under one controlled workflow.
FlexiPCB supports flex PCB assembly from 1-piece prototypes to production with IPC-A-610 Class 2/3 workmanship and IPC-6013 controlled bare-board fabrication.
Polyimide flex, coverlay openings, ENIG pads, stiffeners, and handling fixtures are reviewed before assembly so bend zones are not damaged by component placement or reflow.
Send Gerbers, BOM, centroid, assembly drawing, test requirements, and target quantity so engineering can quote fabrication and assembly together.
Our flex PCB assembly services combine precision manufacturing with careful handling techniques specifically designed for flexible circuits. We understand the unique challenges of assembling on flexible substrates and have developed specialized processes to ensure the highest quality results.
Smartwatches, fitness trackers, and health monitors requiring miniaturized assemblies.
Diagnostic equipment, patient monitors, and hearing aids demanding IPC Class 3 quality.
Smartphones, tablets, and cameras requiring high-volume, cost-effective assembly.
Sensors, displays, and control modules meeting automotive quality standards.
We review your BOM, source components from authorized distributors, and verify availability.
Custom stencils and flex-specific fixtures ensure accurate paste application.
High-speed pick-and-place machines accurately position components on flexible substrates.
Controlled reflow soldering followed by AOI and X-ray inspection for BGA/QFN.
Functional testing, programming if required, and secure packaging for shipment.
Specialized experience handling flexible circuits throughout the assembly process.
IPC-A-610 Class 2/3 workmanship, IPC-6013 controlled bare-flex fabrication, UL material traceability, and inspection records.
Complete solution from bare flex PCB to fully assembled and tested product.
Prototype assemblies in as fast as 5 business days to accelerate your development.
Complete fabrication and assembly data prevents assumptions at quote stage.
Gerber or ODB++, fabrication drawing, stackup, coverlay openings, stiffener locations, and surface finish
BOM, centroid/pick-place, assembly drawing, polarity notes, and approved alternates if turnkey sourcing is needed
IPC-A-610 Class 2 or Class 3 requirement, IPC-6013 bare-board class, UL/RoHS/REACH documentation needs
Test plan: AOI, X-ray, ICT, flying probe, programming, functional test, conformal coating, and packaging requirements
Prototype quantity, pilot quantity, annual forecast, target ship date, and whether components are consigned or sourced
Engineering answers both fabrication and assembly risk in the same response.
DFM/DFA notes on coverlay clearance, pad finish, stiffener support, fixture needs, and reflow risk
Turnkey quote covering bare flex, components, stencil, fixture, SMT, test, packaging, and lead time
Sourcing notes for long-lead or obsolete components and suggested approved alternates where possible
Inspection plan for IPC-A-610 Class 2/3, AOI, X-ray, electrical test, functional test, and report format
Production release checklist for BOM revision, drawing revision, lot traceability, and repeat-order control
Yes. We quote bare flex fabrication, SMT assembly, connector attach, component sourcing, inspection, and functional test as one turnkey flex PCB assembly program. This avoids mismatched coverlay openings, pad finish assumptions, and handling damage that often occur when bare-board fabrication and assembly are split across suppliers.
Assembly workmanship is inspected to IPC-A-610 Class 2 or Class 3 based on your drawing, while the bare flexible circuit is controlled against IPC-6013 requirements. We also support IPC-A-600 inspection context, UL material traceability, RoHS/REACH documentation, AOI, X-ray for BGA/QFN, and functional test records when required.
Specify the polyimide laminate, coverlay or flexible solder mask, stiffener locations, surface finish such as ENIG or OSP, and any dynamic bend zones. ENIG is common for fine-pitch SMT and connector pads, while polyimide coverlay protects flex areas from solder and mechanical damage. We review these choices before quoting so assembly does not compromise bend reliability.
Discover our complete range of flex PCB manufacturing and assembly services
