Flex PCB manufacturer — IPC-6013 Class 3 flexible circuit production

IPC-6013 Class 3 · UL 94V-0 · ISO 13485 · IATF 16949

Flex PCB Manufacturer5-day prototyping · No MOQ · Built for wearables, medical, EV and consumer OEMs

A flexible circuit partner your engineering team can rely on. Flex prototypes and production builds are electrically tested, documented to the requested IPC workmanship class and traceable to substrate lot code.

Free DFM review · No obligation · Engineering responds in 24 hours

Send us 4 things — quote back in 24h

Engineering review · DFM notes same day where possible

  • Gerber files + IPC stack-up (with target impedance if controlled)
  • Target quantity — prototype, pilot batch or annual volume
  • Layer count + flex / rigid zones (static vs dynamic bend region)
  • Required standards — IPC Class, UL 94V-0 materials, ISO 13485 — and 24h SLA window
ISO
audited quality systems
IPC
workmanship documentation
5-day
prototype turnaround
DFM
engineering review on RFQs

Choose the matching flex service

Dedicated pages for the exact flex PCB build you are quoting

If your RFQ is rigid-flex, assembly, multilayer flex, custom flex, or prototype-only, use the matching page below for the most relevant capabilities, stackup notes, FAQs, and quote checklist.

In-house capabilities

Engineering-to-shipping under one roof

DFM, prototyping, controlled-impedance flex, electrical test and PPAP — every step of our flex PCB manufacturer workflow is managed through documented production controls. No black-box outsourcing, no untraceable substitutions on your bill of materials.

1–12 layer flex & rigid-flex stack-up

Single-sided to 12-layer flex, plus 2–14 layer rigid-flex with sequential lamination. DFM review on every quote — we flag manufacturability risk before the PO, not after.

Polyimide & PET substrates

DuPont Kapton (HN, VN, FPC), Shengyi SF305C, plus PET for low-cost flat-cable runs. Adhesiveless polyimide laminates available for high-temp automotive and medical builds.

Coverlay vs flexible solder mask

Polyimide coverlay for high-flex zones, photoimageable LPI solder mask for pad-dense PCBA areas, with ENIG, OSP, hard gold, or selective finish by connector zone.

Dynamic & static flex engineering

Bend radius down to 0.025 mm static, 5 mm dynamic. Stiffener placement, copper grain orientation and trace routing tuned to the deflection profile of your enclosure.

Controlled impedance on flex

Single-ended and differential impedance ±10% on flex layers. HDM measurement on every batch, TDR coupons available on automotive and medical programs.

Mass production automation

Laser direct imaging, automated AOI and electrical test before shipment. Roll-to-roll capability for high-volume wearables and consumer programs.

Stackup and material depth

Polyimide, coverlay, ENIG and IPC documentation reviewed before quote

Flex PCB cost and reliability are set by material stackup, bend-zone design, surface finish, and acceptance class. We return these assumptions with the quote so engineering can approve them before tooling.

1-2 layer flex
Polyimide core, rolled-annealed copper, polyimide coverlay, ENIG or OSP pads
3-10+ layer flex
Sequential lamination, adhesive or adhesiveless polyimide, buried/blind via options, TDR coupons
Rigid-flex
FR4 rigid sections bonded to flex-in-core or flex-on-external polyimide with transition-zone keepout
Assembly-ready finish
ENIG for fine-pitch SMT and connectors, hard gold for ZIF/gold finger contacts, selective finish when needed
Stiffeners
PI, FR4, stainless steel, or aluminum stiffeners for connectors, SMT islands, keypad zones, and assembly fixtures
Documentation
IPC-6013, IPC-A-600/610, UL material traceability, RoHS/REACH COC, electrical test and cross-section reports

Representative applications

Example flex circuit build types

PPAP / FAI / IPC-6013 inspection packages available for procurement review on request.

Wearables

Static bend-radius review for compact wearable hinge designs. 4-layer polyimide stack with adhesive-less laminate and lot-level material traceability.

Medical Devices

Controlled assembly process for surgical robotics flex sensor arrays. 8-layer rigid-flex with controlled impedance traces and ISO 13485 documentation support.

Industrial Automation

Continuous-flex rigid-flex harnesses for drag-chain encoder cables, with IPC-6013 Class 3 workmanship documentation available for procurement review.

Certifications

Certifications procurement actually wants to see

Audit reports, PPAP packages and certification documentation available under NDA before you commit a PO.

ISO 9001
Audited QMS
Quality management system documentation available for review
ISO 13485
Medical QMS
Medical device quality-management support for regulated builds
IATF 16949
Automotive QMS
Automotive quality system with PPAP support
ISO 14001
Environmental QMS
Environmental management system documentation available for review
UL Recognized Component
PCB recognition
UL recognition for PCB component manufacturing
RoHS + REACH
Compliant
EU directives, full Certificate of Compliance available

Industries served

Flex circuits trusted across regulated industries

Each industry team is staffed with engineers who've shipped inside it — automotive PMs from Tier-1 EV suppliers, medical engineers with ISO 13485 design controls experience.

Wearables

  • Smartwatch hinge & strap flex circuits
  • Static bend-zone review
  • Roll-to-roll production for high volume

Medical Devices

  • ISO 13485 cleanroom assembly
  • Surgical robotics sensor flex arrays
  • Biocompatible polyimide substrates

Automotive (EV)

  • IATF 16949 + PPAP Level 3
  • Battery management flex interconnects
  • Temperature-rated 125°C continuous

Consumer Electronics

  • Camera module flex pigtails
  • Foldable display interconnects
  • Cost-optimized PET single-sided runs

Why OEMs choose us as their flex PCB manufacturer

Flex circuit production for engineers who don't accept “close enough”

  • Engineer-to-engineer quoting. Every inquiry routes through a flex PCB engineer — not a sales rep. As your flex PCB manufacturer we send DFM notes back with the quote, not after you commit a PO.
  • No black-box subcontracting. Your flex circuit follows a documented production workflow from coverlay to electrical test. No farmed-out assembly, no untraceable substitutions.
  • Documentation built for procurement. First Article Inspection on every NPI, PPAP Level 3 on automotive programs, full material traceability down to Kapton lot codes.
  • Electrical test before shipment. Every flex circuit — prototype or production — runs continuity, isolation and hi-pot tests on a flying probe or bed-of-nails before it ships.

Real numbers

ISO
audited quality systems
IPC
workmanship documentation
5-day
prototype turnaround
DFM
engineering review on RFQs
Get engineering quote in 24h

Free DFM review · No MOQ

Get a quote

Send Gerber, BOM or a stack-up sketch — quote back in 24 hours

A Gerber package is enough. We'll ask for missing details later. Engineering reviews every inquiry — DFM notes back same day where possible.

Gerber (.zip / .rar), PDF, STEP, DXF supported. NDA available before review.

By submitting you agree to be contacted by our engineering team about your inquiry. We do not share contact details with third parties.

FAQ

Common questions before your first flex circuit order

What is your minimum order quantity as a flex PCB manufacturer?

There is no MOQ. As a flex PCB manufacturer we accept single-unit prototypes from a Gerber package and pilot batches while you validate the design. Production runs can scale after DFM, tooling and quality requirements are approved.

How fast can you ship a flex PCB prototype?

Standard 1–2 layer flex prototypes ship in 5 business days from a signed-off Gerber. 4-layer rigid-flex with controlled impedance typically ships in 7–10 days. Expedited 48-hour service is available on simple stack-ups when production calendar allows.

How many layers can you build in a single flex stack-up?

We routinely build 1–12 layers of pure flex, and 2–14 layers of rigid-flex using sequential lamination. HDI flex with microvias and any-layer interconnects is available for high-density wearable and medical builds. Typical impedance-controlled smartwatch and surgical-robotics builds run 4–8 layers of polyimide with selective rigid sections — our DFM team confirms feasibility, copper grain orientation and bend-radius risk before quoting, so you don't spend three weeks engineering toward a stack-up that can't be laminated to your tolerance.

What flex materials and substrates do you support?

Primarily DuPont Kapton (HN, VN, FPC families) and Shengyi SF305C polyimide for high-reliability builds. PET substrate for low-cost flat-cable runs in consumer and LED programs. Adhesive-less laminates, LCP and high-temperature polyimide are stocked for automotive (125°C+) and medical applications. Coverlay, photoimageable solder mask, electrolytic gold, ENIG and OSP finishes are all available — your DFM engineer recommends the finish per bend zone rather than blanketing the panel.

Are your flex PCBs IPC-6013 Class 3?

IPC-6013 Class 3 workmanship can be specified for high-reliability flex builds. Class 2 builds are also available for cost-sensitive consumer programs. Inspection records, microsection coupons and traceability documents are shareable on procurement audit request.

Where are your flex PCBs manufactured?

Engineering and DFM are coordinated through our Shijiazhuang (Hebei, China) team, with flex production managed through audited group facilities. ISO 9001 / ISO 13485 / IATF 16949 audit reports and factory walkthrough videos are available under NDA before you place a first order.

Ready to talk to a flex PCB manufacturer that reads your Gerber before quoting?

Free DFM review · 24-hour response · No obligation. Upload your Gerber or stack-up and engineering responds with real notes — not templated email.

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