没有支撑的柔性线路不能按普通FR-4硬板来处理。层压结构可能下垂，焊料可能漫入敏感区域，热量也可能损伤胶层和刚挠过渡区。因此我们只接受具备真实支撑、合适遮蔽和可控浸锡条件的项目。
当柔性板在加硬区安装排针、插针或屏蔽罩时，我们会先定义托盘、润湿和排锡路径，再决定是否放行量产。
静态区域内的端子、排针和through-hole硬件需要的是可重复工艺，而不是产线末端返修。
对于要求追溯和FAI的项目，我们只在设计确实允许的区域使用波峰焊，否则优先改为选择性焊接。
We review support conditions, solder-side exposure, component mass, and whether wave soldering is truly justified before approving the route.
For approved jobs, we define pallet support, masking, and immersion depth so static zones are soldered while sensitive flex areas stay protected.
SMT, reflow, and any required bake are completed first. Through-hole parts are then loaded and checked for seating, lead trim, and solder-fill expectations.
Flux, preheat, conveyor settings, and solder contact time are tuned to the actual assembly rather than copied from a rigid-board recipe.
We check fill, bridges, solder balls, and heat impact near flex transitions before documenting the release decision and next-step feedback.
If full-wave is not the right answer, we say that before tooling and schedule are locked.
Support strategy, masking, and immersion assumptions are part of the quotation review, not a surprise found on the line.
You get a process recommendation, lead-time logic, and the specific risks that still need resolution.
技术包越完整，我们越能更快判断该走波峰焊还是选择性焊接。
Gerber or assembly drawing with through-hole parts marked clearly
BOM, connector part numbers, and approved alternates if any
Stiffener, support, or stackup details around connector zones
Prototype, pilot, and production quantities plus FAI or test-report needs
不仅是价格，还有工艺建议、治具假设和真实风险说明。
Process recommendation: palletized wave, selective solder, or controlled manual soldering
Quoted lead time and tooling assumptions
DFM feedback on support, masking, and solder-side exposure
Inspection and first-article documentation plan
不能。大多数无支撑柔性板都不适合。我们会先验证局部刚性、焊接面暴露和载具方案。
当through-hole焊点数量不多、SMT密度较高，或者整板过波会带来不必要风险时，选择性焊接通常更稳妥。
请提供Gerber或装配图、BOM、连接器料号、stiffener信息、数量以及FAI或测试报告要求。
以下资料说明了我们在评估每个项目时参考的标准和焊接方法背景。
Overview of the wave soldering process, equipment behavior, and common defect mechanisms.
Background on IPC workmanship and printed board standards commonly referenced for assembly programs.
Reference background for safety and certification frameworks often requested in regulated electronics programs.
关键并不是把板子送过锡波，而是从一开始就把支撑方式、遮蔽方案和放行标准定义清楚。
