高速信号不能容忍阻抗不连续。当柔性电路传输LVDS、USB 3.x、PCIe、MIPI、车载以太网或100MHz以上RF信号时，阻抗控制是基本设计要求。FlexiPCB使用校准聚酰亚胺基材制造1至10层阻抗控制柔性电路。
USB 3.x、PCIe Gen4/5、HDMI 2.1用阻抗控制差分对。动态弯折区保持90/100欧姆。
100BASE-T1/1000BASE-T1，100欧姆差分。AEC-Q100及IATF 16949。
天线馈电、RF前端用50欧姆控制阻抗。亚GHz至28GHz 5G毫米波。
超声换能器阵列、CT扫描仪多通道阻抗控制。
MIPI CSI-2/DSI，100欧姆差分。超薄180°弯折区阻抗精确。
宽带50欧姆，DC至40GHz，±3%公差。
2D电磁场求解器建模最佳叠层。
选择特性化聚酰亚胺层压板。
LDI ±10µm精度，线宽控制±10%。
真空层压，介电层厚度±10%。
每板含测试券片，IPC-TM-650标准。
电测、IPC-A-610目检。含TDR波形阻抗报告。
2D场求解器建模，非查表估算。
每块板TDR券片验证。
工艺控制确保标准±5%。
全频谱制造经验。
The more complete the package, the faster and cleaner the quote.
Gerber, drawing, or sample photos
BOM, stackup, and key materials
Quantity, target lead time, and application
Designed to help procurement and engineering move without extra loops.
DFM and manufacturability feedback
Quoted price, tooling, and lead time options
Testing and documentation plan
Send your drawing or Gerber, BOM, quantity forecast, application environment, and target lead time. Incomplete inputs slow quotation and increase assumptions.
Our engineers review risks first, then return pricing, lead time, and any DFM or sourcing concerns so you can compare options before release.
Yes. The same workflow supports prototype validation, pilot build, and volume release with traceability and testing requirements carried forward.
