探索我们的先进工厂,配备最新技术用于柔性和刚柔结合PCB生产。
我们现代化的制造工厂将先进自动化与精湛工艺相结合,交付卓越的柔性PCB产品。我们保持严格的环境控制,遵循精益制造原则。
我们投资最新的制造技术以确保精度和可靠性
高精度成像系统,可实现最小25μm线宽/线距的精细线路图案。
CO2和UV激光系统,可钻制最小50μm直径的微孔。
先进的AOI系统,自动缺陷检测和质量验证。
高速电气测试,适用于原型和小批量生产。
表面处理系统,确保最佳附着力和可靠性。
真空层压系统,用于刚柔结合多层结构。
Your flex and rigid-flex boards don't stop at fabrication. This is the in-house SMT / PCBA assembly line in Shenzhen that populates them — the equipment and controls that turn a bare circuit into a finished, tested board.



YAMAHA YSM20R-2 high-speed and YSM10 high-precision platforms, with capacity for up to 20 million placements per day.
Four of our six reflow ovens run a nitrogen atmosphere with oxygen controlled at 500–2,500 ppm, which reduces oxidation-related solder defects and widens the process window for process-critical assemblies.
01005 imperial / 0402 metric (roughly 0.4 × 0.2 mm) runs in stable mass production after DFM review, fed by 10 dedicated original YAMAHA ZSR micro-feeders for 4 mm tape.
Solder-paste dipping with warpage control and X-Ray verification of the stacked joints — running in stable production.
9× 3D SPI and 5× 3D AOI stations — the AI-assisted Sinic-Tek A510D AOI is linked live to MES — with X-Ray (UNICOMP AX8200) for hidden BGA and QFN joints, plus ICT/FCT. Coplanarity is measured on-line to ±0.03 mm per lead.
Assemblies are cleaned with deionized water where the process calls for it, verified by 60–80× microscope inspection against the acceptance standard.
我们精简的制造流程确保一致的质量和准时交付
专业工程师审核您的设计文件并优化可制造性。
在受控环境中准备高品质聚酰亚胺和粘合剂材料。
使用LDI和精密蚀刻工艺创建电路图案。
使用真空层压将多层粘合以获得最佳附着力。
创建过孔并电镀以建立电气连接。
应用最终表面处理并进行100%电气测试。
观看我们先进的制造工艺实况

刚柔结合PCB分离的精密激光切割

先进激光分板技术演示

柔性PCB分板流程
质量融入我们制造流程的每一步。我们全面的QC系统包括:
Contact us to schedule a virtual factory tour or discuss your project requirements.
联系我们的工程团队