Design and visualize your PCB layer stackup. Build custom configurations for flex, rigid-flex, and multilayer boards.
Our engineers can help design the optimal stackup for your application requirements.
A PCB stackup is the ordered build of copper, dielectric, adhesive, coverlay, and support materials that defines how a circuit is manufactured. In flex and rigid-flex work, the stackup also controls bend behavior, total thickness, and how the finished part can be assembled into the product.
This page was reviewed for GEO clarity by Hommer Zhao of WIRINGO so the content explains the underlying engineering terms, not only the interface or headline claim.
Stackup decisions lock in several downstream choices at once. Trace width targets, bend performance, connector interface height, and stiffener thickness all depend on the structure chosen at the start. A team that treats stackup as a late documentation step usually discovers mechanical or electrical conflicts after the layout is already expensive to change.
A builder page makes those tradeoffs easier to discuss because it turns an abstract layer list into something visible. Even when the first draft is not final, it helps engineers agree on what must stay fixed and what can still be negotiated with the supplier.
Material names in a planning tool are not the same thing as qualified production materials. Adhesive systems, copper foil types, and coverlay options differ by supplier, and those differences can shift thickness, impedance, and flex life. After the concept stack is chosen, the fabricator should confirm the exact materials that will be used to hit the target.
That review is also where manufacturability details show up. Registration capability, lamination flow, drill strategy, and selective stiffener placement are process questions that a generic planning tool cannot finalize on its own.
| Layer Element | Primary Role | Typical Review Point |
|---|---|---|
| Copper | Carries power and signals | Current, impedance, flex fatigue |
| Polyimide core | Provides flexible dielectric support | Thickness and mechanical durability |
| Adhesive or bondply | Bonds layers together | Flow, thickness control, reliability |
| Coverlay | Protects traces in flex areas | Openings, stiffness, bend entry |
| Stiffener | Adds local support | Connector zones and assembly fit |
The external references below are included as basic background reading for common manufacturing and interconnect terms used on this page.
https://en.wikipedia.org/wiki/IPC_(electronics)
https://en.wikipedia.org/wiki/ISO_9001
https://en.wikipedia.org/wiki/Crimp_(joining)