Gumagawa ang FlexiPCB ng flexible printed circuit na na-optimize para sa Controller Area Network (CAN) communication. Ang CAN bus ay nananatiling backbone ng automotive networking, na may higit sa 70 ECU sa modernong sasakyan na nagpapalitan ng data sa CAN, CAN FD, at CAN XL link. Pinapalitan ng aming flex PCB ang mabibigat na wiring harness segment sa masikip na espasyo — niru-route ang CAN_H at CAN_L bilang matched differential pair sa manipis na polyimide substrate na nababaluktot sa paligid ng dashboard, door panel, at engine compartment. Pinapanatili namin ang differential impedance sa 120Ω ±5%, natutugunan ang ISO 11898-2 physical layer requirement, at nagpo-process ng build mula single-layer hanggang 6-layer na may integrated EMI shielding para sa matinding electromagnetic na kapaligiran.
CAN flex circuit para sa door module, seat controller, mirror adjuster, at lighting system — pinapalitan ang rigid PCB sa masikip na espasyo ng sasakyan kung saan hindi kasya ang tradisyunal na board.
Flex circuit na nagdadala ng CAN signal sa pagitan ng engine control unit, transmission controller, at battery management system sa electric vehicle. Ang high-temperature polyimide ay tumatagal sa kondisyon sa ilalim ng hood.
CAN FD flex interconnect na nagkokonekta ng radar module, camera unit, LiDAR sensor, at central ADAS domain controller — kung saan ang mababang latency at mataas na data throughput ay hindi pwedeng ikompromiso.
CANopen at DeviceNet flex circuit para sa PLC interconnect, servo motor feedback loop, at sensor network sa factory automation. Ang dynamic flex design ay tumatagal sa milyun-milyong motion cycle sa robotic joint.
CAN bus flex PCB sa patient monitor, infusion pump, at diagnostic imaging equipment — kung saan ang limitadong espasyo at mataas na kinakailangang reliability ay nangangailangan ng flexible circuit solution kumpara sa tradisyunal na wiring.
Bine-verify ng aming mga engineer ang iyong CAN bus schematic para sa tamang transceiver placement, termination resistor positioning, at differential pair routing. Mino-model namin ang 120Ω impedance target laban sa iyong napiling stack-up at copper weight.
Kina-calculate namin ang trace width, spacing, at dielectric thickness para makamit ang 120Ω differential impedance sa flex substrate. Ino-optimize ang ground plane placement para sa return path integrity at EMI suppression.
Ang CAN_H at CAN_L trace ay niru-route bilang tightly coupled differential pair na may matched length. Nagpapatakbo kami ng signal integrity simulation para sa bus length na higit sa 1 metro at data rate na higit sa 1 Mbps.
Bawat CAN bus flex panel ay TDR-tested para i-verify ang 120Ω ±5% differential impedance. Tinitiyak ng AOI, flying probe, at cross-section analysis na ang trace geometry at via quality ay nakakatugon sa IPC Class 2/3 standard.
Nagbibigay kami ng impedance test report, stack-up documentation, at material certification para suportahan ang iyong EMC at automotive qualification testing.
Bawat CAN bus flex board ay may kasamang TDR impedance test data na nagpapatunay ng 120Ω ±5% differential impedance — ang CAN physical layer specification na tinukoy sa ISO 11898-2.
IATF 16949 at ISO 9001 certified na production line na may buong traceability mula raw material hanggang finished board. Available ang PPAP documentation para sa automotive OEM qualification.
Ang sputtered copper, plated copper, at conductive silver-ink shielding layer ay nagpoprotekta sa CAN signal mula sa electromagnetic interference sa mga sasakyan at factory environment na maraming electrical noise.
Automotive-grade polyimide substrate na rated sa 150°C continuous operation na may halogen-free, UL 94 V-0 flame rating. Dinisenyo para sa ilalim ng hood, loob ng cabin, at industrial temperature extreme.
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Gerber, drawing, or sample photos
BOM, stackup, and key materials
Quantity, target lead time, and application
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DFM and manufacturability feedback
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Send your drawing or Gerber, BOM, quantity forecast, application environment, and target lead time. Incomplete inputs slow quotation and increase assumptions.
Our engineers review risks first, then return pricing, lead time, and any DFM or sourcing concerns so you can compare options before release.
Yes. The same workflow supports prototype validation, pilot build, and volume release with traceability and testing requirements carried forward.
Tingnan kung paano kami gumagawa ng impedance-controlled flex circuit para sa CAN communication system
