Rigid-flex PCBs seamlessly integrate rigid and flexible circuit technologies into a single interconnected assembly. By bonding flexible polyimide layers with fixed FR4 stiffeners, these hybrid circuits eliminate the need for connectors and ribbon cables, significantly improving signal integrity while enabling complex 3D packaging solutions. The result is a lighter, more reliable design that withstands vibration, shock, and harsh environmental conditions.
Mission-critical avionics systems, flight controls, satellite communications, and radar equipment. Our 10+ layer rigid-flex designs meet stringent requirements for high signal integrity, lightweight construction, and mechanical resilience with precise impedance control.
Advanced imaging equipment, surgical robots, patient monitoring systems, and implantable devices. Rigid-flex technology enables miniaturization while maintaining the reliability essential for life-critical medical applications.
ADAS sensors, infotainment systems, dashboard displays, and camera assemblies. Rigid-flex PCBs withstand automotive vibration, temperature extremes, and provide reliable interconnections in space-constrained enclosures.
Automation controllers, robotic arms, test equipment, and sensor modules. The mechanical durability of rigid-flex circuits handles continuous movement and harsh industrial environments with exceptional reliability.
Our engineers collaborate on optimal layer stackup configuration—whether bookbinder, asymmetrical, flex-in-core, or flex-on-external—tailored to your specific requirements.
Application-specific material selection based on thermal, mechanical, and electrical requirements. Polyimide flex layers paired with appropriate FR4 or specialty rigid materials.
Precision laser drilling creates ultra-small microvias down to 3 mil diameter, enabling high-density interconnects while maintaining signal integrity.
After mechanical drilling, holes are chemically cleaned and copper-deposited through electroless and electrolytic plating processes for reliable via connections.
Multiple precisely controlled lamination cycles bond rigid and flex layers using coverlay polyimide film with acrylic or epoxy adhesives.
Comprehensive electrical testing verifies isolation, continuity, and circuit performance. Every board is inspected to IPC-A-610H Class 3 standards.
Complete fabrication and assembly under one roof eliminates third-party dependencies and ensures quality control at every step.
Up to 30-layer rigid-flex with 3/3 mil features, heavy copper options, and configurable stack-up configurations for complex designs.
All builds manufactured to IPC-A-610H Class 3 standards, ensuring circuit reliability for aerospace, medical, and automotive applications.
Dedicated rigid-flex engineers provide comprehensive DFM review, design verification, and optimization recommendations with every project.
See our rigid-flex PCB products and manufacturing capabilities
Precision laser cutting for rigid-flex PCB separation
High layer count rigid-flex for industrial control systems
Ultra-complex 20-layer rigid-flex PCB demonstration
Discover our complete range of flex PCB manufacturing and assembly services
