FlexiPCB manufactures high density interconnect (HDI) flex circuits that pack maximum functionality into minimal board area. Our HDI flex PCB capabilities include stacked and staggered microvias, via-in-pad designs, and sequential lamination processes that enable routing densities far exceeding conventional flex circuits. We process builds from 2 to 10 layers with laser-drilled microvias as small as 50μm, supporting fine-pitch BGA packages down to 0.3mm pitch.
Ultra-thin HDI flex circuits for smartphone camera modules, display interconnects, and smartwatch mainboards requiring maximum component density in minimal space.
Biocompatible HDI flex for cochlear implants, pacemaker leads, endoscopy cameras, and surgical instruments where miniaturization is critical.
Lightweight HDI flex circuits for satellite communication modules, avionics, UAV flight controllers, and radar systems requiring high-reliability interconnects.
High-density flex circuits for LiDAR modules, camera systems, and sensor fusion units in advanced driver assistance systems.
HDI flex circuits with controlled impedance for 5G antenna modules, mmWave front-end modules, and high-frequency signal routing.
Our HDI engineers analyze your design for microvia feasibility, stack-up optimization, and impedance modeling. We recommend the optimal via structure (stacked, staggered, or skip) for your density requirements.
HDI flex builds use sequential lamination cycles — each layer pair is laminated, drilled, and plated before adding subsequent layers. This enables buried and stacked microvia structures.
UV laser drilling creates microvias down to 50μm diameter with precise depth control. Copper-filled vias provide reliable interconnection for via-in-pad and stacking applications.
LDI (Laser Direct Imaging) achieves 2mil trace/space resolution for high-density routing between fine-pitch BGA pads and microvia lands.
Every HDI flex board undergoes TDR impedance verification, microvia cross-section analysis, flying probe electrical testing, and AOI inspection to meet IPC Class 3 standards.
UV laser systems achieve 50μm microvia diameter with ±10μm positional accuracy — enabling the highest routing densities on flex substrates.
Multi-cycle lamination with precise registration (±25μm) for stacked microvias up to 3 levels deep. Full copper fill ensures reliable via stacking.
Our HDI specialists review every design for manufacturability, recommending stack-up changes that reduce cost while maintaining signal integrity.
ISO 9001, ISO 13485, and IATF 16949 certified. Every HDI flex board is cross-sectioned, impedance-tested, and electrically verified.
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