Flex PCB Manufacturer

Precision Flexible Circuits

ISO 9001|ISO 13485|IATF 16949
Engineering review before quotationPrototype through volume productionTest report and traceability support
Flex PCB Manufacturer

Flexible PCB Fabrication

FlexiPCB manufactures flex PCBs with layer counts from 1 to 6, with ultimate builds extending to 10 layers for specialized multi-layer flex circuits. Fabrication uses polyimide base materials such as Shengyi SF305, Songxia RF-775, and Taihong PI, supporting dielectric stability, thermal resistance, and fine-line processing. For most buyer programs, the real decision is whether flex PCB reduces total installed cost by removing connectors, shrinking the enclosure, or simplifying assembly. A recent medical wearable build consolidated three rigid interconnect boards into one 2-layer flex design, cutting final assembly time by 27% and removing two board-to-board connector failure points. Budget-wise, a simple prototype often lands around USD 180-350, while multilayer controlled-impedance flex with stiffeners and selective finish can move into the USD 600-1,500 range before assembly.

1-6 layers standard, up to 10 layers ultimate
Min 3mil trace/space, 0.1mm laser drill
Single-ended impedance ±5Ω (advanced: ±3Ω)
Board thickness 0.05-0.5mm (ultimate: 0.8mm)
Lead time 3-6 days, expedited 2-4 days
100% AOI and flying probe tested
Typical prototype budget: USD 180-350 simple flex, USD 600+ for multilayer controlled-impedance builds
Best ROI when flex eliminates connectors, reduces assembly labor, or fits a moving mechanical envelope

Technical Specifications

Layer Count1-6 layers (Ultimate: 7-10 layers)
Base Material (Adhesive)Shengyi SF302 (PI: 0.5/1/2mil, Cu: 0.5/1oz), SF305 (PI: 0.5/1/2mil, Cu: 0.33/0.5/1oz)
Base Material (Adhesiveless)Songxia RF-775/777 (PI: 1/2/3mil, Cu: 0.5/1oz, Ultimate: 2oz), Xinyang (PI: 1/2mil, Cu: 0.33/0.5/1oz), Taihong (PI: 1/2mil, Cu: 0.33/0.5/1oz), Dupont AP (PI: 1/2/3/4mil, Cu: 0.5/1oz, Ultimate: 2oz)
Board Thickness (Flex Part)0.05-0.5mm (Ultimate: 0.5-0.8mm)
Min. Size5mm×10mm (Bridgeless), 10mm×10mm (Bridge); Ultimate: 4mm×8mm / 8mm×8mm
Max. Size9"×14" (Ultimate: 9"×23" with PI≥1mil)
Impedance (Single-ended)±5Ω (≤50Ω), ±10% (>50Ω); Ultimate: ±3Ω (≤50Ω), ±8% (>50Ω)
Impedance (Differential)±5Ω (≤50Ω), ±10% (>50Ω); Ultimate: ±4Ω (≤50Ω), ±8% (>50Ω)
Budgetary Prototype RangeUSD 180-350 simple flex; USD 600-1,500 multilayer or controlled-impedance flex
Best Production Cost LeverReduce connector count, standardize stiffeners, and lock panel utilization early
Finger Width Tolerance±0.1mm (Ultimate: ±0.05mm)
Min. Distance to Finger Edge8mil (Ultimate: 6mil)
Min. Distance Between Pads4mil (Ultimate: 3mil)
Min. Laser Hole0.1mm
Min. PTH0.3mm
Min. NPTH Tolerance±2mil (Ultimate: +0/-2mil or +2/-0mil)
Solder Bridge (Cu<2oz)4mil (Green), 8mil (Other colors)
Solder Bridge (Cu 2-4oz)6mil (Green), 8mil (Other colors)
Coverlay ColorWhite, Yellow (printed character: White)
Surface FinishOSP, HASL, Lead-Free HASL, ENIG, Hard Gold, Immersion Silver
Selective Surface FinishENIG+OSP, ENIG+Gold Finger

Applications

Consumer Electronics

Smartphones, wearables, cameras, and portable devices requiring compact, flexible interconnects with space-saving layouts. Buyers here usually justify flex by cutting assembly steps and reclaiming enclosure volume.

Medical Devices

Implantable devices, catheters, hearing aids, and diagnostic equipment demanding biocompatibility and high reliability. Validation risk, stackup stability, and documentation often matter as much as lead time.

Automotive

Dashboard displays, sensors, LED lighting, and engine control units requiring vibration resistance and durable bend performance. Cost is usually recovered by simplifying routed packaging and replacing multiple connectors.

Aerospace & Defense

Satellites, avionics, and military systems where weight reduction and connection reliability are critical. The real objection is usually documentation and repeatability, not just bare-board price.

Our Manufacturing Process

1

Design Review

Our engineers analyze your Gerber files for manufacturability and suggest optimizations for flex circuit design, especially bend-zone copper balancing, stiffener placement, and panel yield.

2

Material Selection

We select optimal polyimide materials (Shengyi, Dupont, Songxia) based on your bend radius and thermal requirements.

3

Circuit Fabrication

Precision LDI imaging with 3mil trace/space capability and laser drilling for HDI flex circuits.

4

Coverlay Application

Protective coverlay lamination with precise alignment for circuit protection and insulation.

5

Testing & Inspection

100% electrical testing with flying probe and AOI inspection ensures quality and reliability.

Why Choose FlexiPCB?

Fast Lead Time

Standard delivery in 3-6 days. Expedited options available in 2-4 days for urgent projects, which matters most when prototype validation is blocking enclosure or assembly testing.

Design Support

Free DFM review and expert guidance on flex circuit design, material selection, and bend radius optimization. We push back when rigid PCB or FFC is commercially smarter instead of forcing flex into the design.

Quality Certified

ISO 9001, ISO 13485, IATF 16949, and UL certified. 100% AOI inspection and flying probe testing. Buyers worried about hidden risk usually need process control more than the absolute lowest unit quote.

Factory Direct Pricing

Competitive pricing from our 15,000m² manufacturing facility with transparent quotes and no hidden fees. In most programs, the strongest savings come from panel utilization, connector elimination, and stackup simplification rather than squeezing laminate cost alone.

Send This With Your RFQ

The more complete the package, the faster and cleaner the quote.

Gerber, drawing, or sample photos

BOM, stackup, and key materials

Quantity, target lead time, and application

What You Get Back

Designed to help procurement and engineering move without extra loops.

DFM and manufacturability feedback

Quoted price, tooling, and lead time options

Testing and documentation plan

What should we send for a fast RFQ?

Send your drawing or Gerber, BOM, quantity forecast, application environment, and target lead time. Incomplete inputs slow quotation and increase assumptions.

What happens after we submit the inquiry?

Our engineers review risks first, then return pricing, lead time, and any DFM or sourcing concerns so you can compare options before release.

Can you support prototypes and repeat production under one program?

Yes. The same workflow supports prototype validation, pilot build, and volume release with traceability and testing requirements carried forward.

Flex PCB Manufacturing Process

Watch our precision flex PCB depaneling process in action

Flex Printed Board Depaneling

High-precision flexible PCB depaneling and separation process

Explore Our Other Services

Discover our complete range of flex PCB manufacturing and assembly services