FlexiPCB manufactures flex PCBs with layer counts from 1 to 6, with ultimate builds extending to 10 layers for specialized multi-layer flex circuits. Fabrication uses polyimide base materials such as Shengyi SF305, Songxia RF-775, and Taihong PI, supporting dielectric stability, thermal resistance, and fine-line processing.
Smartphones, wearables, cameras, and portable devices requiring compact, flexible interconnects with space-saving layouts.
Implantable devices, catheters, hearing aids, and diagnostic equipment demanding biocompatibility and high reliability.
Dashboard displays, sensors, LED lighting, and engine control units requiring vibration resistance and durable bend performance.
Satellites, avionics, and military systems where weight reduction and connection reliability are critical.
Our engineers analyze your Gerber files for manufacturability and suggest optimizations for flex circuit design.
We select optimal polyimide materials (Shengyi, Dupont, Songxia) based on your bend radius and thermal requirements.
Precision LDI imaging with 3mil trace/space capability and laser drilling for HDI flex circuits.
Protective coverlay lamination with precise alignment for circuit protection and insulation.
100% electrical testing with flying probe and AOI inspection ensures quality and reliability.
Standard delivery in 3-6 days. Expedited options available in 2-4 days for urgent projects.
Free DFM review and expert guidance on flex circuit design, material selection, and bend radius optimization.
ISO 9001, ISO 13485, IATF 16949, and UL certified. 100% AOI inspection and flying probe testing.
Competitive pricing from our 15,000m² manufacturing facility with transparent quotes and no hidden fees.
Watch our precision flex PCB depaneling process in action
High-precision flexible PCB depaneling and separation process
Discover our complete range of flex PCB manufacturing and assembly services
