.pilot production ﻭﺃ EVT ﻰﻟﺇ ﻝﺎﻘﺘﻧﻻﺍ ﻦﻣ ﻻًﺪﺑ ﺮﺧﺁ ﻲﻟﻭﺃ ﺝﺫﻮﻤﻧ ﺓﺭﻭﺩﻭ ،ﻢﺳﺮﻟﺍ ﺓﺩﺎﻋﺇ ﺖﻗ
.RFQ ﺝﻭﺮﺧ ﻞﺒﻗ ﺔﺤﺿﺍﻭ ﺮﺒﻋ ﻚﺘﻄﺧ ﻥﻮﻜﺗ ﻥﺃ ﺐﺠﻴﻓ ،(https://en.wikipedia.org/wiki/IPC_(electronics) [IPC] ﺕﺎﻌﻗﻮﺘﻟ ﺎﻘًﻓﻭ
.ﺔﻴﻗﻮﺛﻮﻤﻟﺍ ﻦﻴﺴﺤﺗ ﻥﻭﺩ ﺔﻴﻨﻣﺯ ﺔﻠﻬﻣ ﻒﻴﻀﺗ ﻲﺘﻟﺍﻭ ﻁﺮﻔﻣ ﻞﻜﺸﺑ ﺓﺩﺪﺤﻤﻟﺍ ﺕﺎﺳﺪﻜﺘﻟﺍﻭ ،ﻕﺍﺮﺘﺧﻼ
ﻞﻘﺤﻟﺍ ﺓﺎﻴﺣﻭ ﺔﻴﺟﺎﺘﻧﻹﺍ ﻖﻳﺮﻃ ﻦﻋ ﺔﻴﺠﻴﺗﺍﺮﺘﺳﻹﺍ ﺩﺪﺤﺗ ﺍﺫﺎﻤﻟ ##
.ﺰﺘﻬﻳ ﻭﺃ ﻱﻮﻄﻳ ﻭﺃ ﺞﺘﻨﻤﻟﺍ ﻲﻨﺤﻨﻳ ﺎﻣﺪﻨﻋ ﺓﺩﺎﺳﻮﻟﺍ ﺔﻬﺟﺍﻭ ﻭﺃ ﺔﻴﺳﺎﺤﻨﻟﺍ ﺔﻧﺍﻮﻄﺳﻷﺍ ﻰﻟﺇ ﺓﺮﺷ
.ﺱﺎﺒﺘﻗﻻﺍ ﺔﻗﺩ ﻦﻴﺴﺤﺗ ﻰﻠﻋ ﺎﻀًﻳﺃ ﻞﻤﻌﻳ ءﺎﻨﺤﻧﻻﺍ ﺔﻴﻗﻮﺛﻮﻣ ﻦﻴﺴﺤﺗ ﻰﻠﻋ ﻞﻤﻌﻳ ﻱﺬﻟﺍ ﻁﺎﺒﻀﻧﻻﺍ ﺲ
| Via type | Typical use on flex PCB | Main advantage | Main risk | Best commercial fit |
|---|---|---|---|---|
| Plated through hole (PTH) | static flex, rigid-flex rigid zones, connector breakout | lowest cost and broad supplier support | too much stiffness if placed near active bend | general-purpose prototypes and medium-density layouts |
| Blind microvia | HDI breakout, fine-pitch BGA, rigid-flex transition | saves routing area and shortens breakout path | higher cost from laser drilling and sequential build | dense designs where space matters more than unit cost |
| Buried via | multilayer rigid zones only | routing freedom inside rigid section | not useful in moving flex area and adds stackup complexity | advanced rigid-flex with dense core routing |
| Via-in-pad filled and capped | fine-pitch component pads, RF modules, compact rigid zones | shortest escape and better assembly planarity | extra fill/cap process and tighter vendor capability requirements | premium compact designs with proven supplier capability |
| Plated slot or elongated via feature | high-current terminals, shield tie points, mechanical anchor zones | improved current path or anchoring shape | drill/routing complexity and more copper stress if misused | special-purpose interconnect or power entry zones |
| Staggered rigid-only via field | rigid-flex component area before flex tail | keeps routing density high while protecting the moving section | requires disciplined transition planning | best balance for most production rigid-flex programs |
**".ﻙﺍﺮﻜﻟﺍ ﺔﻳﺭﻭﺪﻟﺍ ﺔﻟﻼﺴﻟﺍ ﺎﻬﻴﻓ ﺃﺪﺒﻳ ﻲﺘﻟﺍ ﺔﻘﻴﻗﺪﻟﺍ ﺔﻄﻘﻨﻟﺍ ﺢﺒﺼﻳ ﻝﺍﺰﻳ ﻻﻭ ،ﻲﻔﻴﻇﻮﻟﺍ
5 Flex PCB ﻦﻤﺜﻟﺍ ﺔﻈﻫﺎﺒﻟﺍ ﻢﻴﻤﺼﺘﻟﺍ ﺓﺩﺎﻋﺇ ﺕﺎﻴﻠﻤﻋ ﻊﻨﻤﺗ ﻲﺘﻟﺍ ﺪﻋﺍﻮﻘﻟﺍ ﺮﺒﻋ
.ﺝﺎﺘﻧﻹﺍ ﺭﺎﻌﺳﺃ ﺽﺮﻋ ﺕﺎﺒﻠﻃ ﺔﻌﺟﺍﺮﻣ ﺪﻨﻋ ﺎﺒًﻟﺎﻏ ﺎﻬﻣﺪﺨﺘﺴﻧ ﻲﺘﻟﺍ ﺪﻋﺍﻮﻘﻟﺍ ﻲﻫ ﻩﺬﻫ .ﻢﻴﻤﺼﺘﻟﺍ
.ﻊﻴﻓﺭ ﻙﺮﺤﺘﻣ ﻢﺴﻗ ﻰﻠﻋ HDI ﺕﺍﺰﻴﻣ ﺭﺎﺒﺟﺇ ﻦﻣ ﺺﺧﺭﺃ ﻥﻮﻜﻳ ﺎﻣ ﺓﺩﺎﻋ ﺍﺬﻫﻭ .ﺯﺍﺰﺘﻫﻻﺍ ﻭ
**".ﺎﺑًﺍﺬﺟ ﻭﺪﺒﻳ ﺮﻌﺴﻟﺍ ﻥﺎﻛ ﻮﻟ ﻰﺘﺣ ﺔﻤﻬﻤﻟﺍ ﻲﻓ ﺍﺩًﻮﺟﻮﻣ ﻝﺍﺰﻳ ﻻ ﺮﻄﺨﻟﺍ ﻥﺈﻓ ،ﺓﺩﻮﻘﻔﻣ ﺔﻴﻠﻤ
ﺝﺎﺘﻧﻺﻟ ﻥﺮﻤﻟﺍ ﻢﻴﻤﺼﺘﻟﺍ ﻲﻓ ﺭﺍﺮﻤﺘﺳﻻﺍ Vias ـﻟ ﻦﻜﻤﻳ ﻻ ﻭﺃ ﻦﻜﻤﻳ ﺚﻴﺣ ##
.ﺔﻘﻄﻨﻣ ﻞﻛ ﻲﻓ ﺔﻴﺠﻴﺗﺍﺮﺘﺳﻹﺍ ﺮﻴﻐﺘﺗ ﻥﺃ ﺐﺠﻳ .ﻲﻘﻴﻘﺣ bend zoneﻭ ،transition zoneﻭ ،ﻯﻮﻘﻣ ﻭﺃ ﺪ
- **component zone ﻕﺍﺮﺘﺧﻻﺍ ﺮﺒﻋ ﺔﻓﺎﺜﻜﻠﻟ ﺎﻧًﺎﻣﺃ ﺮﺜﻛﻷﺍ ﻥﺎﻜﻤﻟﺍ ﻮﻫ ﺍﺬﻫ **:ﺔﺒﻠﺼﺘﻤﻟﺍ ﻭﺃ ﺔﺒﻠ
.ﺔﻴﻘﻴﻘﺤﻟﺍ ﻲﻜﻴﻧﺎﻜﻴﻤﻟﺍ ﻡﺍﺪﺨﺘﺳﻻﺍ ﺔﻟﺎﺣ ﻊﻣ ﻖﺑﺎﻄﺘﻳ ﺎﻣﺪﻨﻋ ﻂﻘﻓ ﺎﻨًﻣﺁ ﺐﻴﺴﻨﺘﻟﺍ ﻥﻮﻜﻳ :ءﺍﺮﺸ
ﺭﺍﺮﻘﻟﺍ ﺮﺒﻋ ﺭﺍﺮﻗ ﻞﻜﻟ ﺔﻴﻨﻣﺰﻟﺍ ﺓﺪﻤﻟﺍﻭ ﺔﻔﻠﻜﺘﻟﺍ ﺮﻴﺛﺄﺗ ##
.ﺱﺪﻜﻤﻟﺍ ﺮﻴﻴﻐﺗ ﻰﻠﻋ ﺔﻘﻓﺍﻮﻤﻟﺍ ﻞﺒﻗ ﺎﻬﻨﻤﺛ ﻥﻮﻌﻓﺪﻳ ﻲﺘﻟﺍ ﺔﺌﻔﻟﺍ ﻢﻬﻓ ﻦﻳﺮﺘﺸﻤﻟﺍ ﻰﻠﻋ ﺐﺠﻳ .ﻂ
| Via decision | Typical manufacturing impact | Cost effect | Lead-time effect | When it is worth paying for |
|---|---|---|---|---|
| Standard PTH in static zone | mechanical drill and standard plating | baseline | baseline | most low- to mid-density flex designs |
| Smaller mechanical drill with tighter annular ring | tighter registration and plating control | low to moderate increase | small increase | when routing is close but standard process still works |
| Laser blind microvia | laser drill plus sequential lamination | moderate increase | moderate increase | fine-pitch breakout and compact rigid-flex modules |
| Filled and capped via-in-pad | extra fill, planarization, and cap process | moderate to high increase | moderate increase | fine-pitch assembly or RF pads that truly need it |
| Overusing microvias in non-critical areas | unnecessary HDI process steps | high increase with little field benefit | moderate to high increase | almost never; simplify instead |
| Moving via field out of bend area and widening breakout | may increase local routing length but simplifies reliability control | often neutral or cheaper overall | often neutral or better | nearly always for moving flex sections |
.ﻊﻴﻤﺠﺘﻟﺍ ﻯﻮﺘﺴﻣ ﻰﻠﻋ ﺍﺩًﻮﻴﻗ ﺎﻘًﻠﻄﻣ ﻯﺮﻳ ﻻ ﻢﺴﻗ ﻲﻓ ﺔﺌﺒﻌﺘﻟﺍ ﻝﻼﺧ ﻦﻣ ﺪﻳﺰﻤﻟﺍ ﺩﺭﻮﻤﻟﺍ ﺡﺮﺘﻗﺍ
**".ﻥﺎﻜﻣ ﻞﻛ ﻲﻓ ءﻭﺪﻬﺑ ﻦﻤﺜﻟﺍ ﺔﻈﻫﺎﺑ ﺔﻴﻠﻤﻌﻟﺍ ﻖﻴﺒﻄﺗ ﻦﻣ ﻻًﺪﺑ ﻂﺒﻀﻟﺎﺑ ﺞﻳﺰﻤﻟﺍ ﺍﺬﻫ ﺮﻴﻌﺴﺘﺑ
ﺕﺎﻔﻠﻤﻟﺍ ﺮﻳﺮﺤﺗ ﻞﺒﻗ RFQ ﻖﻘﺤﺘﻟﺍ ﺔﻤﺋﺎﻗ ##
:ﺔﻴﻟﺎﺘﻟﺍ ﺮﺻﺎﻨﻌﻟﺍ ﺪﻴﻛﺄﺘﺑ ﻢﻗ ،ﻦﻳﺩﺭﻮﻤﻟﺍ ﻰﻟﺇ ﻊﻴﻤﺠﺘﻟﺍ ﻭﺃ ++ODB ﻭﺃ Gerbers ﺕﺎﻈﺣﻼﻣ
ﺔﻣﺪﺨﻟﺍ ﻲﻓ ﺓﺮﺋﺍﺪﻟﺍ ﺖﻛﺮﺤﺗ ﺍﺫﺇ no-via keepout ﺎﻬﻧﺃ ﻰﻠﻋ ﺎﻬﻴﻠﻋ ﺔﻣﻼﻋ ﻊﺿﻭﻭ ﻲﻜﻴﻣﺎﻨﻳﺪﻟﺍ ءﺎﻨﺤ
.ﺭﺍﺪﺻﻹﺍ ﺲﻔﻧ ﻰﻠﻋ ﺍﺪًﺑﺃ ﺪﻤﺘﻌﺗ ﻢﻟ ﻲﺘﻟﺍ ﻡﺎﻗﺭﻷﺍ ﺔﻧﺭﺎﻘﻣ ﻲﻓ ﺖﻗﻮﻟﺍ ﻊﻴﻀﺗ ﻑﻮﺳﻭ ﺔﻔﻠﺘﺨﻣ ﺕﺎﺿ
ﺕﺎﻤﻴﻠﻌﺘﻟﺍ ##
؟ﻥﺮﻣ PCB ﻰﻠﻋ plated through holes ﻡﺍﺪﺨﺘﺳﺍ ﻦﻜﻤﻳ ﻞﻫ ###
.ﻞﻴﻣﺮﺒﻟﺍ ﻰﻟﺇ ﺓﺩﺎﺳﻮﻟﺍ ﺔﻬﺟﺍﻭ ﻰﻠﻋ ﺓﺭﺮﻜﺘﻤﻟﺍ ﺔﻛﺮﺤﻟﺍ ﺰﻛﺮﺗ ﺚﻴﺣ ﻭﺃ ﺔﻄﺸﻧ ءﺎﻨﺤﻧﺍ ﺔﻘﻄﻨﻣ ﻲ
؟rigid-flex ﻢﻴﻤﺼﺘﻟ ﺔﻴﻓﺎﺿﻹﺍ ﺔﻔﻠﻜﺘﻟﺍ microvia ﻖﺤﺘﺴﻳ ﻰﺘﻣ ###
.ﺮﺒﻛﺃ ﺔﺒﻠﺻ ﺔﻘﻄﻨﻣ ﻰﻟﺇ ﻕﺍﺮﺘﺧﻻﺍ ﻞﻘﻧ ﻖﻳﺮﻃ ﻦﻋ ﻪﻴﺟﻮﺘﻟﺍ ﻑﺪﻫ ﺲﻔﻧ ﻖﻴﻘﺤﺗ ﻦﻜﻤﻳ ﺎﻣﺪﻨﻋ ﻊﻓﺪﻟ
؟dynamic bend zone ﻲﻓ ﺬﻓﺎﻨﻤﻟﺍ ﻊﺿﻭ ﺐﺠﻳ ﻞﻫ ###
.ﺱﺪﻜﻤﻟﺍ ﻚﻤﺳﻭ ،ﺕﺍﺭﻭﺪﻟﺍ ﺩﺪﻋﻭ ،ءﺎﻨﺤﻧﻻﺍ ﺮﻄﻗ ﻒﺼﻧ ﻞﺑﺎﻘﻣ ﻪﺘﻌﺟﺍﺮﻣ ﺐﺠﻳﻭ ﺩﺪﺤﻣ ﺔﻴﻗﻮﺛﻮﻣ ﺭﺮ
؟ﺔﻧﺮﻤﻟﺍ PCB ﺕﺎﻋﻮﻤﺠﻣ ﻰﻠﻋ ﻦﻣﺁ via-in-pad ﻞﻫ ###
.ﺔﻴﻜﻴﻧﺎﻜﻴﻤﻟﺍ ﺮﻃﺎﺨﻤﻟﺍ ﺽﻮﻌﺗ ﻻ ﺞﻣﺪﻤﻟﺍ ﺏﻭﺮﻬﻟﺍ ﺔﻤﻴﻗ ﻥﻷ ﺔﻣﻮﻋﺪﻤﻟﺍ ﺮﻴﻏ ﺔﻛﺮﺤﺘﻤﻟﺍ ﻡﺎﺴﻗﻸﻟ
؟ﺓﺭﺪﻘﻟﺍ ﻝﻼﺧ ﻦﻣ ﻪﻨﻋ ﺩﺭﻮﻤﻟﺍ ﻝﺄﺴﻳ ﻥﺃ ﻱﺮﺘﺸﻤﻟﺍ ﻰﻠﻋ ﺐﺠﻳ ﻱﺬﻟﺍ ﺎﻣ ###
.HDI ءﺎﻨﺑ ﻪﻨﻜﻤﻳ ﺮﺠﺘﻤﻟﺍ ﻥﺄﺑ ﻡﺎﻋ ءﺎﻋﺩﺍ ﺩﺮﺠﻣ ﻦﻣ ﺮﺜﻛﺃ ﺔﻤﻬﻣ ﻞﻴﺻﺎﻔﺘﻟﺍ ﻩﺬﻫ .ﻞﻌﻔ
؟ﺔﻌﺟﺍﺮﻤﻟﺍ ﻝﻼﺧ ﻦﻣ ﺔﻗﻮﺛﻮﻣ ﺔﻧﺮﻣ PCB ﺔﺣﻮﻟ ﻰﻠﻋ ﻝﻮﺼﺤﻠﻟ ﺎﻬﻠﺳﺭﺃ ﻥﺃ ﺐﺠﻳ ﻲﺘﻟﺍ ﺕﺎﻔﻠﻤﻟﺍ ﻲﻫ
.ﺔﻴﻗﻮﺛﻮﻣ ﺮﺜﻛﺃ ﻥﻮﻜﺗ ﺮﺒﻋ ﺔﻴﺻﻮﺘﻟﺍ ﻥﺈﻓ ،ﺎﻣًﺪﻘﻣ ﻑﺪﻬﻟﺍ ﻝﻮﺒﻗﻭ ﺔﻛﺮﺤﻟﺍ ﻒﻳﺮﻌﺗ ﻒﻠﻣ ﺩﺭﻮﻤﻟﺍ
ﻲﻘﻴﻘﺣ ﺭﺎﻌﺳﺃ ﺽﺮﻋ ﺞﺘﻨﺗ ﺔﻌﺟﺍﺮﻣ ﺔﻣﺰﺣ ﻞﺳﺭﺃ :ﺔﻴﻟﺎﺘﻟﺍ ﺓﻮﻄﺨﻟﺍ ##
.ﺔﻘﺜﺑ ﻪﺘﻧﺭﺎﻘﻣ ﻚﻨﻜﻤﻳ ﺭﺎﻌﺳﺃ ﺽﺮﻋ ﺱﺎﺳﺃﻭ ،DFM ﺕﺎﻘﻴﻠﻌﺗﻭ ،ﺔﻴﻠﻤﻋ ءﺎﻨﺑ ﺔﻴﺻﻮﺗ ﻯﺮﺧﺃ
