Flex circuit tanpa support tidak boleh diperlakukan seperti papan FR-4 kaku. Laminasi bisa melendut, solder bisa mengalir ke area sensitif, dan panas bisa membebani adhesive serta transisi flex-rigid. Karena itu kami hanya menerima program dengan support mekanis yang nyata, masking yang benar, dan kedalaman celup yang terkontrol.
Jika flex membawa header, pin, atau shield di area yang diberi stiffener, kami tentukan pallet, wetting, dan drain path sebelum produksi dilepas.
Terminal, header, dan hardware through-hole di area statis membutuhkan proses yang repeatable, bukan rework di ujung line.
Untuk program dengan traceability dan FAI, kami hanya memakai wave di area yang memang didukung desain, lalu beralih ke selective soldering jika itu lebih aman.
We review support conditions, solder-side exposure, component mass, and whether wave soldering is truly justified before approving the route.
For approved jobs, we define pallet support, masking, and immersion depth so static zones are soldered while sensitive flex areas stay protected.
SMT, reflow, and any required bake are completed first. Through-hole parts are then loaded and checked for seating, lead trim, and solder-fill expectations.
Flux, preheat, conveyor settings, and solder contact time are tuned to the actual assembly rather than copied from a rigid-board recipe.
We check fill, bridges, solder balls, and heat impact near flex transitions before documenting the release decision and next-step feedback.
If full-wave is not the right answer, we say that before tooling and schedule are locked.
Support strategy, masking, and immersion assumptions are part of the quotation review, not a surprise found on the line.
You get a process recommendation, lead-time logic, and the specific risks that still need resolution.
Semakin lengkap paket teknisnya, semakin cepat kami bisa memutuskan antara wave dan selective.
Gerber or assembly drawing with through-hole parts marked clearly
BOM, connector part numbers, and approved alternates if any
Stiffener, support, or stackup details around connector zones
Prototype, pilot, and production quantities plus FAI or test-report needs
Bukan hanya harga, tetapi juga rekomendasi proses, asumsi tooling, dan gambaran risiko yang nyata.
Process recommendation: palletized wave, selective solder, or controlled manual soldering
Quoted lead time and tooling assumptions
DFM feedback on support, masking, and solder-side exposure
Inspection and first-article documentation plan
Tidak. Sebagian besar flex tanpa support bukan kandidat yang baik. Kami cek dulu rigiditas lokal, paparan sisi solder, dan strategi carrier.
Saat sambungan through-hole hanya sedikit, kepadatan SMT tinggi, atau paparan full-wave menambah risiko yang tidak perlu.
Gerber atau assembly drawing, BOM, part number konektor, detail stiffener, quantity, dan persyaratan FAI atau test report.
Sumber-sumber ini menjelaskan standar dan metode soldering yang menjadi dasar evaluasi proses kami.
Overview of the wave soldering process, equipment behavior, and common defect mechanisms.
Background on IPC workmanship and printed board standards commonly referenced for assembly programs.
Reference background for safety and certification frameworks often requested in regulated electronics programs.
Kuncinya bukan sekadar melewatkan board ke atas wave, tetapi menetapkan support, masking, dan release criteria sejak awal.
