Ang flex circuit na walang support ay hindi dapat tratuhing parang karaniwang FR-4 board. Maaaring lumundo ang laminate, kumalat ang solder sa sensitibong area, at ma-stress ng init ang adhesive at flex-rigid transitions. Kaya tumatanggap lang kami ng programang may totoong mechanical support, tamang masking, at kontroladong immersion depth.
Kapag may headers, pins, o shields ang flex sa stiffened zone, dine-define muna namin ang pallet, wetting, at drain path bago i-release sa production.
Ang terminals, headers, at through-hole hardware sa static zones ay nangangailangan ng repeatable process, hindi end-of-line rework.
Para sa mga programang may traceability at FAI, wave lang ang ginagamit namin kung suportado talaga ng design; kung hindi, lumilipat kami sa selective soldering.
We review support conditions, solder-side exposure, component mass, and whether wave soldering is truly justified before approving the route.
For approved jobs, we define pallet support, masking, and immersion depth so static zones are soldered while sensitive flex areas stay protected.
SMT, reflow, and any required bake are completed first. Through-hole parts are then loaded and checked for seating, lead trim, and solder-fill expectations.
Flux, preheat, conveyor settings, and solder contact time are tuned to the actual assembly rather than copied from a rigid-board recipe.
We check fill, bridges, solder balls, and heat impact near flex transitions before documenting the release decision and next-step feedback.
If full-wave is not the right answer, we say that before tooling and schedule are locked.
Support strategy, masking, and immersion assumptions are part of the quotation review, not a surprise found on the line.
You get a process recommendation, lead-time logic, and the specific risks that still need resolution.
Kapag mas kumpleto ang technical package, mas mabilis naming mapipili kung wave o selective ang tamang proseso.
Gerber or assembly drawing with through-hole parts marked clearly
BOM, connector part numbers, and approved alternates if any
Stiffener, support, or stackup details around connector zones
Prototype, pilot, and production quantities plus FAI or test-report needs
Hindi lang presyo, kundi pati process recommendation, tooling assumptions, at totoong risk picture.
Process recommendation: palletized wave, selective solder, or controlled manual soldering
Quoted lead time and tooling assumptions
DFM feedback on support, masking, and solder-side exposure
Inspection and first-article documentation plan
Hindi. Karamihan sa unsupported flex boards ay hindi magandang kandidato. Tinitingnan muna namin ang local rigidity, solder-side exposure, at carrier strategy.
Kapag kaunti lang ang through-hole joints, mataas ang SMT density, o ang full-wave exposure ay nagdadagdag ng hindi kailangang risk.
Gerber o assembly drawing, BOM, connector part numbers, stiffener details, quantity, at anumang FAI o test report requirement.
Ipinapaliwanag ng mga source na ito ang standards at soldering method na batayan ng aming process review.
Overview of the wave soldering process, equipment behavior, and common defect mechanisms.
Background on IPC workmanship and printed board standards commonly referenced for assembly programs.
Reference background for safety and certification frameworks often requested in regulated electronics programs.
Ang mahalaga ay hindi lang ang pagpadaan ng board sa wave, kundi ang maagang pagtakda ng support, masking, at release criteria.
