Prozkoumejte nase nejmodernejsi zarizeni vybavene nejnovejsimi technologiemi pro vyrobu flex a rigid-flex PCB.
Nase moderni vyrobni zarizeni kombinuje pokrocilou automatizaci se zkusenym remeslem pro dodani vyjimecnych flex PCB produktu. Dodrzujeme prisne environmentalni kontroly a ridime se principy stihle vyroby.
Investujeme do nejnovejsich vyrobnich technologii pro zajisteni presnosti a spolehlivosti
Vysoce presne zobrazovaci systemy pro jemne liniove vzory az do 25μm cesty/mezery.
CO2 a UV laserove systemy pro vrtani mikro-prokopu az do prumeru 50μm.
Pokrocile AOI systemy pro automatizovanou detekci vad a overeni kvality.
Vysokorychlostni elektricke testovani pro prototypy a maloseriovou vyrobu.
Systemy povrchove upravy pro optimalni adhezi a spolehlivost.
Vakuove laminacni systemy pro vicevrstvou konstrukci rigid-flex.
Your flex and rigid-flex boards don't stop at fabrication. This is the in-house SMT / PCBA assembly line in Shenzhen that populates them — the equipment and controls that turn a bare circuit into a finished, tested board.



YAMAHA YSM20R-2 high-speed and YSM10 high-precision platforms, with capacity for up to 20 million placements per day.
Four of our six reflow ovens run a nitrogen atmosphere with oxygen controlled at 500–2,500 ppm, which reduces oxidation-related solder defects and widens the process window for process-critical assemblies.
01005 imperial / 0402 metric (roughly 0.4 × 0.2 mm) runs in stable mass production after DFM review, fed by 10 dedicated original YAMAHA ZSR micro-feeders for 4 mm tape.
Solder-paste dipping with warpage control and X-Ray verification of the stacked joints — running in stable production.
9× 3D SPI and 5× 3D AOI stations — the AI-assisted Sinic-Tek A510D AOI is linked live to MES — with X-Ray (UNICOMP AX8200) for hidden BGA and QFN joints, plus ICT/FCT. Coplanarity is measured on-line to ±0.03 mm per lead.
Assemblies are cleaned with deionized water where the process calls for it, verified by 60–80× microscope inspection against the acceptance standard.
Nas zefektivneny vyrobni proces zajistuje konzistentni kvalitu a vcasne dodani
Zkuseni inzenyri kontroluji vase navrhove soubory a optimalizuji je pro vyrobitelnost.
Vysoce kvalitni polyimidove a lepici materialy jsou pripraveny v nasem kontrolovanem prostredi.
Obvodove vzory jsou vytvareny pomoci LDI a presnich procesu leptani.
Vice vrstev je spojeno pomoci vakuove laminace pro optimalni adhezi.
Prokovy jsou vytvoreny a pokoveny pro navazani elektrickych spojeni.
Konecne povrchove upravy jsou aplikovany a provadi se 100% elektricke testovani.
Sledujte nase pokrocile vyrobni procesy v akci

Presne laserove rezani pro separaci rigid-flex PCB

Ukazka pokrocile technologie laseroveho depanelovani

Proces depanelovani flexibilnich PCB
Kvalita je zabudovana do kazdeho kroku naseho vyrobniho procesu. Nas komplexni system kontroly kvality zahrnuje:
Contact us to schedule a virtual factory tour or discuss your project requirements.
Kontaktujte nas tým inzenyru