Блог о проектировании печатных плат

A B2B sourcing guide for overmolded FPC cable assembly NPI. Compare silicone mold samples, hard tooling, DFM gates, cost, lead time, standards, and RFQ evidence before production release.

A sourcing and engineering checklist for preventing FPC cable assembly defects: crimping, soldering, labels, dimensions, strain relief, 100% inspection, OQC, and RFQ evidence.

A sourcing and engineering guide for preventing high-impedance defects in micro-coax and FPC cable assemblies, with RFQ data, test plans, standards, cost, and lead-time checks.

How rigid-flex PCB design scales from smart glasses to AR/VR headsets: multiple displays, higher layer counts, thermal management, dense sensor arrays, and high-speed display interconnect. A design and sourcing guide for headset hardware teams.

Design a hinge flex PCB for repeated open/close cycles: neutral axis, copper balance, bend radius, and cycle-life math. Practical rules for laptop hinges, smart-glasses temples, and folding devices.

An IPC-6013 rigid-flex inspection checklist for engineers and quality teams: what IPC-6013 governs, Class 1/2/3 differences, and the rigid-flex-specific acceptance criteria for the transition zone, bend region, and plated interconnect — plus an RFQ and incoming-inspection checklist.

What drives rigid-flex PCB cost: layer count, lamination cycles, flex material, panel utilization, stiffeners, and bend-zone yield. Plus when rigid-flex is actually cheaper than rigid boards plus cables and connectors at the system level.

Practical rigid-flex PCB design guidelines: rigid/flex zone partition, copper balance in the bend zone, coverlay and no-flow prepreg keepout, stiffener placement, via keepout, and layer symmetry. A DFM checklist for engineers who want first-pass yield.

How to design a rigid-flex PCB for smart glasses: temple-arm architecture, hinge bend zones, ultra-thin stackups, ENIG camera pads, and MIPI impedance. Concrete specs and a layout checklist for AR/AI glasses teams.