Foldable phones represent the cutting edge of mobile device design, and the flex circuits inside them push flexible PCB technology to its absolute limits. These circuits must survive hundreds of thousands of fold cycles while maintaining signal integrity for high-speed display data in a package thin enough to allow tight fold radius.
The challenges are immense: bend radius as tight as 1.5mm, fold cycles exceeding 200,000, and total thickness measured in fractions of a millimeter - all while routing high-speed MIPI signals and maintaining EMI shielding. Success requires the most advanced materials, processes, and design practices available.
Our foldable device flex capability combines adhesiveless polyimide construction, rolled annealed copper, laser-drilled microvias, and precision manufacturing to create circuits worthy of flagship foldable devices. We support the leading smartphone manufacturers in bringing foldable innovation to market.
Validated for 200,000+ fold cycles - the equivalent of opening and closing a phone 100 times per day for over 5 years. No degradation in electrical or mechanical performance.
Bend radius as tight as 1.5mm enables the compact fold mechanisms in today's foldable phones. Every design element optimized for minimum radius.
Total thickness from 0.08mm through the fold zone. Adhesiveless construction eliminates bulk while improving flexibility.
MIPI DSI/CSI routing at 4+ Gbps through the fold zone with controlled impedance and integrated shielding. No compromise on display performance.
Creating flex circuits for foldable devices requires solving multiple simultaneous challenges.
Standard flex circuits would fail after thousands of folds. Our foldable designs use specialized copper types, optimized geometry, and validated materials to achieve 200,000+ cycle life.
High-resolution foldable displays require high-speed data links through the fold zone. Impedance control and shielding must be maintained even as the circuit bends repeatedly.
Every micron of thickness increases fold radius and housing bulk. We optimize every layer to minimize total thickness while meeting electrical requirements.
Flagship devices demand premium quality. Our manufacturing processes deliver the yield and reliability that smartphone brands expect for their premium products.
The flex circuit must integrate with complex hinge mechanisms. Design accommodates routing paths, anchor points, and clearances for the folding system.
Foldable flex requires the most advanced materials and construction techniques.
Traditional adhesive-based construction is too thick and inflexible for foldable applications. Our adhesiveless construction bonds copper directly to polyimide for minimum thickness.
RA copper's grain structure provides superior flex fatigue resistance compared to electrodeposited copper. Essential for dynamic fold applications.
Copper thickness of 9-12µm (¼oz or less) further improves flexibility while maintaining current capacity for required signals.
EMI shielding through sputtered metal or thin plated copper layers. Shield design balances EMI performance with flexibility.
Ultra-thin polyimide coverlay (12.5µm or less) with appropriate adhesive or adhesiveless bonding. Color matched for visual integration.
Every design decision impacts fold life and performance.
All traces perpendicular to fold axis. Curved traces avoid stress concentration at fold edges. Uniform trace distribution balances stress across the circuit.
No vias in fold zone. Vias placed in non-fold regions with appropriate distance from fold boundaries.
Hatched ground patterns in fold zone improve flexibility vs. solid planes. Pattern orientation optimized for fold axis.
Symmetric layer stackup places fold at neutral axis. Balanced copper distribution prevents curl and stress.
Gradual transitions from fold zone to non-fold areas distribute stress. Avoid abrupt changes in construction.
Anchor points secure flex circuit to housing. Design prevents stress concentration at anchor locations.
Primary display interconnect for clamshell foldable smartphone. Routes 4-lane MIPI DSI through 2mm radius fold zone. 200,000+ cycle validated.
Multi-flex assembly for book-fold tablet connecting left and right halves. Separate flex paths for display, touch, and peripheral signals.
Flex circuit connecting displays in dual-screen smartphone configuration. Routes through rotating hinge mechanism with 360° capability.
We validate designs for 200,000+ fold cycles with no electrical or mechanical degradation. Actual life depends on design, materials, and operating conditions. We perform accelerated life testing to verify performance.
Our most aggressive designs achieve 1.5mm bend radius for dynamic folding. Achievable radius depends on layer count, copper weight, and other design factors. We optimize designs for your required radius.
Fold zone thickness can be as thin as 0.08mm for optimized single or double layer designs. Total thickness depends on layer count, shield requirements, and connector regions.
Yes, we design for MIPI DSI/CSI at 4+ Gbps through fold zones. Impedance control and shielding are maintained through the fold. We work with your signal integrity requirements.
We support prototype through high-volume production for foldable devices. Our processes are scaled for the quality and volume requirements of flagship smartphone programs.
