Eight layers and beyond represent the cutting edge of flexible circuit technology. These ultra-high-density flex PCBs serve applications where no other interconnect technology can meet the requirements for routing density, electrical performance, and mechanical flexibility combined.
At 8+ layers, flex PCBs enable truly three-dimensional circuit design. Any-layer via technology allows interconnection between any two layers without consuming routing channels on intermediate layers. Multiple power domains, extensive shielding, and complex high-speed interfaces can all coexist in a flexible format.
Our advanced manufacturing facility is equipped for the most demanding multilayer flex requirements. Sequential lamination, laser drilling, precision registration, and rigorous process control ensure every layer meets specifications in these complex constructions.
ALIVH (Any Layer Interstitial Via Hole) technology enables via connections between any adjacent layers. Maximum routing flexibility for complex designs.
Layer counts from 8 to 16+ enable routing densities impossible with fewer layers. Support for the finest pitch components and highest I/O counts.
Multiple dedicated power and ground planes support complex power distribution networks. Ideal for mixed-signal and high-current applications.
High-performance polyimide and specialty dielectrics selected for demanding environments. Space-grade and high-reliability options available.
8+ layer flex PCBs serve the most demanding applications where other technologies cannot meet requirements.
Deep space probes, satellite buses, and launch vehicle electronics use 8+ layer flex for complex systems in extreme environments with no margin for failure.
Neural interfaces, high-channel-count imaging systems, and implantable devices with complex functionality require the density only 8+ layers can provide.
Advanced radar, electronic warfare, and secure communication systems use 8+ layer flex for mission-critical reliability with complex functionality.
Advanced AI accelerators and high-speed memory interfaces use 8+ layer flex for maximum bandwidth in compact packages.
Probe cards and test interfaces for advanced semiconductor nodes require the signal integrity and density of 8+ layer flex.
8+ layer flex manufacturing requires the most advanced processes and tightest controls.
Multiple lamination cycles build up the layer structure. Each cycle must maintain precise registration and bond quality.
Layer-to-layer registration becomes critical with many layers. Advanced imaging and drilling equipment maintain alignment across the full stackup.
Laser drilling, mechanical drilling, and various via formation techniques combine to create the required interconnect structures.
Total thickness must be controlled while maintaining required dielectric spacing for impedance control. Process optimization balances these requirements.
100% electrical testing, cross-section analysis, and reliability qualification validate manufacturing quality on every lot.
Designing 8+ layer flex requires partnership between design engineering and manufacturing.
Engage our engineering team early in the design process. We help optimize stackup, via strategy, and layer assignment before design completion.
Layer count, material selection, and dielectric spacing all impact manufacturability. We work iteratively to achieve your requirements while maintaining yield.
Complex stackups require careful impedance planning. We provide impedance models and stackup recommendations for your target values.
High-density designs may require thermal management attention. Copper distribution and thermal via strategies are part of the design review.
Define reliability requirements early. Material selection and design rules are influenced by environmental and lifetime requirements.
16-layer rad-hard flex for space exploration instrument. NASA Class 3 workmanship with full lot traceability for mission-critical reliability.
12-layer biocompatible flex for 1024-channel neural recording. Ultra-fine features with integrated amplification and multiplexing.
10-layer flex connecting 256-element phased array. Controlled impedance with integrated power distribution and thermal management.
We support layer counts up to 16 layers in all-flex construction. Higher layer counts are available in rigid-flex configurations. Contact us to discuss your specific requirements.
Prototype lead time is typically 15-20 business days for standard designs. Complex HDI structures or special materials may require additional time. We provide detailed schedules during quotation.
Multiple inspection and test points throughout manufacturing validate each process step. 100% electrical testing, cross-section analysis on sample basis, and comprehensive documentation ensure quality.
Our manufacturing is supported by AS9100D for aerospace, ISO 13485 for medical devices, and ISO 9001 for general quality management. NADCAP accreditation is available for special processes.
Yes, we support prototype quantities from 5 pieces. NRE costs cover tooling and process setup for complex multilayer designs. We provide prototype-to-production transition support.
